Issued Patents All Time
Showing 1–25 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347791 | Integrated circuit package and method | Chen-Hua Yu, Tzu-Yun Huang, Hung-Jui Kuo | 2025-07-01 |
| 12341072 | Manufacturing method of semiconductor package | Shih-Hao Tseng, Hung-Jui Kuo | 2025-06-24 |
| 12322682 | Semiconductor package having composite seed-barrier layer and method of forming the same | Wei-Chung Chang, Hung-Jui Kuo | 2025-06-03 |
| 12300598 | Package structure and method of fabricating the same | Yi-Wen Wu, Hung-Jui Kuo | 2025-05-13 |
| 12288729 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2025-04-29 |
| 12191203 | Semiconductor package | Wei-Chung Chang, Hung-Jui Kuo | 2025-01-07 |
| 12183691 | Semiconductor structure and method of forming the same | Ching-Wen Chen, Hung-Jui Kuo | 2024-12-31 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2024-12-24 |
| 12131986 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu | 2024-10-29 |
| 12094830 | Integrated fan-out (InFO) package structure | Hung-Jui Kuo, Tzung-Hui Lee | 2024-09-17 |
| 11948890 | Semiconductor package and method | Shih-Hao Tseng, Hung-Jui Kuo | 2024-04-02 |
| 11935804 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2024-03-19 |
| 11901230 | Semiconductor package and manufacturing method thereof | Wei-Chung Chang, Hung-Jui Kuo | 2024-02-13 |
| 11855014 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2023-12-26 |
| 11842955 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure | Chen-Hua Yu, Hung-Jui Kuo, Tzung-Hui Lee | 2023-12-12 |
| 11823981 | Semiconductor package and manufacturing method thereof | Wei-Chung Chang, Hung-Jui Kuo | 2023-11-21 |
| 11775063 | Display device and display method | Wen Lin Tsai | 2023-10-03 |
| 11658105 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu | 2023-05-23 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2023-05-02 |
| 11626339 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2023-04-11 |
| 11605601 | Semiconductor package and method of forming the same | Ching-Wen Chen, Hung-Jui Kuo | 2023-03-14 |
| 11594484 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2023-02-28 |
| 11545457 | Semiconductor package, redistribution structure and method for forming the same | Chiang-Hao Lee, Hung-Jui Kuo | 2023-01-03 |
| 11495506 | Semiconductor package with separate electric and thermal paths | Shih-Hao Tseng, Hung-Jui Kuo | 2022-11-08 |
| 11495507 | Manufacturing method of a semiconductor package | Shih-Hao Tseng, Hung-Jui Kuo, Chia-Hung Liu | 2022-11-08 |