Issued Patents All Time
Showing 51–75 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840212 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Chung-Shi Liu | 2020-11-17 |
| 10734341 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2020-08-04 |
| 10700001 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2020-06-30 |
| 10599942 | Target tracking method and system adaptable to multi-target tracking | Shih-Hao Kuo | 2020-03-24 |
| 10510646 | Packae structure, RDL structure and method of forming the same | Tzung-Hui Lee, Hung-Jui Kuo | 2019-12-17 |
| 10501660 | Method of selectively removing tungsten over silicon oxide | Yun-Lung Ho, Chung-Wei Chiang, Song-Yuan Chang, Ming-Hui Lu | 2019-12-10 |
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Chung-Shi Liu | 2019-11-19 |
| 10461051 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2019-10-29 |
| 10423848 | Method, system, and computer-readable recording medium for long-distance person identification | You-Jyun Syu, Ching-An Cho | 2019-09-24 |
| 10361139 | Semicondcutor package and manufacturing method thereof | Shih-Hao Tseng, Hung-Jui Kuo, Chia-Hung Liu | 2019-07-23 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2019-05-21 |
| 10297544 | Integrated fan-out package and method of fabricating the same | Yi-Wen Wu, Hung-Jui Kuo | 2019-05-21 |
| 10235576 | Analysis method of lane stripe images, image analysis device, and non-transitory computer readable medium thereof | Shang-Min YEH, Yu-Wen Huang, Yueh-Chi Hung, Yi-Sheng Chao | 2019-03-19 |
| 10163832 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Tzu-Yun Huang | 2018-12-25 |
| 10134700 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-20 |
| 10079200 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Yi-Wen Wu | 2018-09-18 |
| 10074623 | Method of fabricating redistribution circuit structure | Tzung-Hui Lee, Hung-Jui Kuo, Tzu-Yun Huang | 2018-09-11 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2018-08-14 |
| 10033987 | Device for generating depth information, method for generating depth information, and stereo camera | Ben Wu, Pei-Chun Yeh | 2018-07-24 |
| 10009595 | Image calibration system and calibration method of a stereo camera | Wen-Kuo Lin | 2018-06-26 |
| 9953891 | Method of forming post-passivation interconnect structure | Yi-Wen Wu, Zheng-Yi Lim, Chung-Shi Liu | 2018-04-24 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2018-04-03 |
| 9899342 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Tzung-Hui Lee, Hung-Jui Kuo, Tzu-Yun Huang | 2018-02-20 |
| 9871009 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2018-01-16 |
| 9718991 | Chemical mechanical polishing slurry | Yi Yang, Wen-Cheng Liu, Ming-Hui Lu, Song-Yuan Chang | 2017-08-01 |