Issued Patents All Time
Showing 101–112 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8827695 | Wafer's ambiance control | Yi-Li Hsiao, Chen-Hua Yu, Jean Wang, Chien Ling Hwang, Jui-Pin Hung | 2014-09-09 |
| 8791579 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2014-07-29 |
| 8703546 | Activation treatments in plating processes | Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2014-04-22 |
| 8659155 | Mechanisms for forming copper pillar bumps | Ming-Da Cheng, Wen-Hsiung Lu, Chih-Wei Lin, Ching-Wen Chen, Yi-Wen Wu +2 more | 2014-02-25 |
| 8641920 | Polishing composition for planarizing metal layer | Song-Yuan Chang, Ming-Hui Lu | 2014-02-04 |
| 8609526 | Preventing UBM oxidation in bump formation processes | Chung-Shi Liu, Cheng-Chung Lin, Kuo-Cheng Lin, Meng-Wei Chou | 2013-12-17 |
| 8569897 | Protection layer for preventing UBM layer from chemical attack and oxidation | Chung-Shi Liu, Chien Ling Hwang | 2013-10-29 |
| 8405199 | Conductive pillar for semiconductor substrate and method of manufacture | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Chung-Shi Liu | 2013-03-26 |
| 8227334 | Doping minor elements into metal bumps | Ming-Da Cheng, Chung-Shi Liu, Chien Ling Hwang, Cheng-Chung Lin, Hui-Jung Tsai +1 more | 2012-07-24 |
| 8172641 | CMP by controlling polish temperature | Jean Wang, Lawrence Chiang Sheu | 2012-05-08 |
| 6233167 | Power-transforming device | Chun-Chen Chen | 2001-05-15 |
| 6062300 | Evenly heat-dissipating apparatus | Chia-Hua Wang, Wen-Shan Chuans | 2000-05-16 |