Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840212 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2020-11-17 |
| 10483230 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2019-11-19 |
| 9691738 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2017-06-27 |
| 9430605 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2016-08-30 |
| 9117772 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2015-08-25 |
| 9111064 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2015-08-18 |
| 8791579 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2014-07-29 |
| 8501615 | Metal bump formation | Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Wen-Hsiung Lu, Zheng-Yi Lim +2 more | 2013-08-06 |