Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840212 | Bonding package components through plating | Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2020-11-17 |
| 10483230 | Bonding package components through plating | Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2019-11-19 |
| 9953891 | Method of forming post-passivation interconnect structure | Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2018-04-24 |
| 9691738 | Bonding package components through plating | Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2017-06-27 |
| 9275965 | Copper pillar bump with cobalt-containing sidewall protection layer | Chien Ling Hwang, Chung-Shi Liu | 2016-03-01 |
| 9117772 | Bonding package components through plating | Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2015-08-25 |
| 9099396 | Post-passivation interconnect structure and method of forming the same | Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2015-08-04 |
| 9048135 | Copper pillar bump with cobalt-containing sidewall protection | Chien Ling Hwang, Chung-Shi Liu | 2015-06-02 |
| 8865586 | UBM formation for integrated circuits | Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2014-10-21 |
| 8501615 | Metal bump formation | Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu +2 more | 2013-08-06 |
| 8258055 | Method of forming semiconductor die | Chien Ling Hwang, Ying-Jui Huang, Yi-Yang Lei, Cheng-Chung Lin, Chung-Shi Liu | 2012-09-04 |
| 8242011 | Method of forming metal pillar | Yi-Wen Wu, Wen-Hsiung Lu, Chih-Wei Lin, Tzong-Huann Yang, Hsiu-Jen Lin +2 more | 2012-08-14 |
| 8227334 | Doping minor elements into metal bumps | Ming-Da Cheng, Ming-Che Ho, Chung-Shi Liu, Chien Ling Hwang, Cheng-Chung Lin +1 more | 2012-07-24 |