Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237188 | Machine learning on overlay management | Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Kewei Zuo | 2025-02-25 |
| 12197138 | Machine learning on overlay management | Tzu-Cheng Lin, Kewei Zuo, Ming-Tan Lee, Zi-Jheng Liu | 2025-01-14 |
| 11626304 | Machine learning on overlay management | Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Kewei Zuo | 2023-04-11 |
| 10964566 | Machine learning on overlay virtual metrology | Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Kewei Zuo | 2021-03-30 |
| 10054938 | Clustering for prediction models in process control and for optimal dispatching | Jung Cheng Ko, Tzu-Yu Wang, Kewei Zuo, Kuan Teng Lo, Chih-Wei Lai | 2018-08-21 |
| 9588505 | Near non-adaptive virtual metrology and chamber control | Tzu-Yu Wang, Chen-Hua Yu, Henry Lo, Jung Cheng Ko, Chih-Wei Lai +1 more | 2017-03-07 |
| 9508653 | Die-tracing in integrated circuit manufacturing and packaging | Kewei Zuo, Wen-Yao Chang | 2016-11-29 |
| 9430605 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2016-08-30 |
| 9390060 | Packaging methods, material dispensing methods and apparatuses, and automated measurement systems | Chih-Wei Lai, Chih-Chiang Chang, Kewei Zuo, Jing-Cheng Lin | 2016-07-12 |
| 9390491 | System and method for automatic quality control for assembly line processes | Kewei Zuo, Tzu-Cheng Lin, Chih-Wei Lai | 2016-07-12 |
| 9153506 | System and method for through silicon via yield | Kewei Zuo, Chen-Hua Yu, Jing-Cheng Lin, Yen-Hsin Liu | 2015-10-06 |
| 9111064 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2015-08-18 |
| 9010617 | Solder joint reflow process for reducing packaging failure rate | Chen-Hua Yu, Wen-Yao Chang, Kewei Zuo, Chung-Shi Liu | 2015-04-21 |
| 8945983 | System and method to improve package and 3DIC yield in underfill process | Yen-Hsin Liu, Cing-He Chen, Kewei Zuo | 2015-02-03 |
| 8791579 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chia-Tung Chang, Hung-Jui Kuo +1 more | 2014-07-29 |
| 8445296 | Apparatus and methods for end point determination in reactive ion etching | Tzu-Cheng Lin, Yu-Jen Cheng, Chih-Wei Lai, Hung-Pin Chang, Tsang-Jiuh Wu | 2013-05-21 |
| 5171412 | Material deposition method for integrated circuit manufacturing | Homoyoun Talieh, Avi Tepman, Hoa Kieu | 1992-12-15 |
| 5108570 | Multistep sputtering process for forming aluminum layer over stepped semiconductor wafer | — | 1992-04-28 |