Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728238 | Semiconductor package with heat dissipation films and manufacturing method thereof | Ting-Yu Yeh, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu | 2023-08-15 |
| 8945983 | System and method to improve package and 3DIC yield in underfill process | Yen-Hsin Liu, Kewei Zuo, Chien Rhone Wang | 2015-02-03 |