Issued Patents All Time
Showing 1–25 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334464 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh | 2025-06-17 |
| 12327781 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Kuan-Yu Huang +1 more | 2025-06-10 |
| 12315786 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Kuan-Yu Huang +1 more | 2025-05-27 |
| 12300573 | Semiconductor device and manufacturing method thereof | Bo-Jiun Yang, Wen-Sung Hsu, Tai-Yu Chen, Sheng-Liang Kuo | 2025-05-13 |
| 12261151 | Integrated circuit packages | Yung-Chi Lin, Wen-Chih Chiou | 2025-03-25 |
| 12087664 | Semiconductor package having liquid-cooling lid | Tai-Yu Chen, Sheng-Liang Kuo, Bo-Jiun Yang | 2024-09-10 |
| 12080638 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2024-08-13 |
| D1025864 | Vehicle interior | Tse-Min Cheng, Lu-Han Lee | 2024-05-07 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh | 2024-05-07 |
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2024-04-23 |
| 11927991 | Synchronized hinges for foldable displays | Christopher A. Torres, Enoch Chen, Anthony J. Sanchez, Hsu-Hong Yao, Mo-Yu Zhang | 2024-03-12 |
| 11907027 | Gear synchronized dual axis pivot hinge | Christopher A. Torres, Kevin M. Turchin, Enoch Chen, Anthony J. Sanchez, Kai-Cheng Chao +1 more | 2024-02-20 |
| 11908767 | Semiconductor package structure | Che-Hung Kuo, Hsing-Chih Liu | 2024-02-20 |
| 11728238 | Semiconductor package with heat dissipation films and manufacturing method thereof | Ting-Yu Yeh, Cing-He Chen, Kuo-Chiang Ting, Weiming Chris Chen | 2023-08-15 |
| 11728314 | Methods of forming integrated circuit packages | Yung-Chi Lin, Wen-Chih Chiou | 2023-08-15 |
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2023-07-18 |
| 11660984 | Hardness adjustment unit, seat, and seat adjustment system | — | 2023-05-30 |
| 11640930 | Semiconductor package having liquid-cooling lid | Tai-Yu Chen, Sheng-Liang Kuo, Bo-Jiun Yang | 2023-05-02 |
| 11621211 | Semiconductor package structure | Ya-Jui Hsieh, Tai-Yu Chen, Yao-Pang Hsu | 2023-04-04 |
| 11619978 | Electronic device and hinge structure | Cheng-Shiue Jan, Chien-Chu Chen, Wei-Hao Lan | 2023-04-04 |
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh | 2022-12-20 |
| 11492436 | Modified polyvinyl alcohol-based polymer and its application | Jyun-Ru Sun, Huan Chang, Cheng-Fan Wang | 2022-11-08 |
| 11476184 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Pin-Tso Lin +1 more | 2022-10-18 |
| 11439240 | Adjustable seat | Tsu-Yi Tsai | 2022-09-13 |