Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334464 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2025-06-17 |
| 12322729 | Semiconductor device | Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2025-06-03 |
| 12080638 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou | 2024-08-13 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2024-05-07 |
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2022-12-20 |
| 11508696 | Semiconductor device | Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-22 |
| 11476184 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2022-10-18 |
| 11139282 | Semiconductor package structure and method for manufacturing the same | Kuo-Chiang Ting, Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Wan-Yu Lee +1 more | 2021-10-05 |
| 10867954 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2020-12-15 |
| 10720401 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2020-07-21 |
| 10515888 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2019-12-24 |
| 10515869 | Semiconductor package structure having a multi-thermal interface material structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou | 2019-12-24 |
| 10510722 | Semiconductor device and method for manufacturing the same | Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2019-12-17 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Ting-Yu Yeh, Chia-Hsin Chen, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2019-05-28 |
| 10170457 | COWOS structures and method of forming the same | Wei-Ming Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2019-01-01 |
| 9806062 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Hung-Jung Tu, Yu-Liang Lin, Shih-Hui Wang | 2017-10-31 |
| 9406650 | Methods of packaging semiconductor devices and packaged semiconductor devices | Shin-Puu Jeng, Wen-Chih Chiou, Hung-Jung Tu, Yu-Liang Lin, Shih-Hui Wang | 2016-08-02 |
| 9093489 | Selective curing method of adhesive on substrate | Wen-Chih Chiou, Hung-Jung Tu, Yu-Liang Lin | 2015-07-28 |
| 7670869 | Semiconductor device and fabrications thereof | — | 2010-03-02 |
| 7138654 | Chemical-mechanical polishing proximity correction method and correction pattern thereof | Pai Sun, Yu-Chia Chen | 2006-11-21 |
| 6906377 | Flash memory cell and fabrication thereof | Chih-Jung Ni, Chung-Ming Chu, Kuo-Chen Wang, Wen-Shun Lo, Haochieh Liu | 2005-06-14 |
| 6382861 | Cleaning device for cleaning dirt produced from manufacturing equipment | Ting-Kou Chen, Chi-Yeh Huang, Yi-Yuan Chen | 2002-05-07 |