Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400989 | Arrangement of power-grounds in package structures | Chun Hua Chang, Fong-Yuan Chang, Jyh Chwen Frank Lee | 2025-08-26 |
| 12334464 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2025-06-17 |
| 12327781 | Semiconductor structure and manufacturing method thereof | Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more | 2025-06-10 |
| 12315786 | Semiconductor structure and manufacturing method thereof | Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more | 2025-05-27 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih +1 more | 2025-04-08 |
| 12062590 | Method for manufacturing semiconductor package structure | Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2024-08-13 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih +1 more | 2024-05-21 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2024-05-07 |
| 11929340 | Arrangement of power-grounds in package structures | Chun Hua Chang, Fong-Yuan Chang, Jyh Chwen Frank Lee | 2024-03-12 |
| 11728238 | Semiconductor package with heat dissipation films and manufacturing method thereof | Cing-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu | 2023-08-15 |
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2022-12-20 |
| 11139282 | Semiconductor package structure and method for manufacturing the same | Kuo-Chiang Ting, Tu-Hao Yu, Chia-Hao Hsu, Weiming Chris Chen, Wan-Yu Lee +1 more | 2021-10-05 |
| 10867954 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2020-12-15 |
| 10720401 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2020-07-21 |
| 10626375 | Disease control of the plant bacterial pathogens causing citrus canker and rice blight | — | 2020-04-21 |
| 10515869 | Semiconductor package structure having a multi-thermal interface material structure | Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2019-12-24 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Chia-Hsin Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2019-05-28 |
| 9899305 | Semiconductor package structure | Wei-Ming Chen, Yi Sun | 2018-02-20 |