Issued Patents All Time
Showing 1–25 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400878 | Integrated circuit package and method | Shih-Ting Lin, Szu-Wei Lu, Kuo-Chiang Ting, Shang-Yun Hou, Weiming Chris Chen | 2025-08-26 |
| 12334464 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2025-06-17 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2025-06-10 |
| 12322729 | Semiconductor device | Weiming Chris Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou | 2025-06-03 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12253729 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting +1 more | 2025-03-18 |
| 12242108 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou | 2025-03-04 |
| 12243833 | Semiconductor device with electromagnetic interference film and method of manufacture | Hsien-Wei Chen, Li-Hsien Huang, Tien-Chung Yang | 2025-03-04 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2024-11-12 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2024-09-10 |
| 12080638 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12051652 | Package structure and method of fabricating the same | Shih-Ting Lin, Chen-Hua Yu, Szu-Wei Lu | 2024-07-30 |
| 12033898 | Method of fabricating a FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Kuang-Hsin Chen | 2024-07-09 |
| 12020953 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 12009335 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2024-06-11 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2024-05-07 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2024-04-23 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11961779 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2024-04-16 |
| 11852868 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou | 2023-12-26 |
| 11842983 | Semiconductor structure | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2023-12-12 |
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2023-12-05 |
| 11764139 | Semiconductor device and method | Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai | 2023-09-19 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |