Issued Patents All Time
Showing 26–50 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721559 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2023-08-08 |
| 11664322 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2023-05-16 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11626296 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2023-04-11 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2023-03-21 |
| 11587845 | Semiconductor structure | Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2023-02-21 |
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2022-12-20 |
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-12-13 |
| 11508696 | Semiconductor device | Weiming Chris Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou | 2022-11-22 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2022-11-22 |
| 11493689 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou | 2022-11-08 |
| 11476184 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2022-10-18 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2022-10-11 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11462418 | Integrated circuit package and method | Shih-Ting Lin, Szu-Wei Lu, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou | 2022-10-04 |
| 11454773 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting +1 more | 2022-09-27 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11417606 | Package structure and method of fabricating the same | Shih-Ting Lin, Chen-Hua Yu, Szu-Wei Lu | 2022-08-16 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-08-16 |
| 11373969 | Semiconductor package and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2022-06-28 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2022-06-07 |
| 11342196 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2022-05-24 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |