Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412805 | Semiconductor package | Chen-Hsiang Lao, Yuan Sheng Chiu, Hung-Chi Li, Tsung-Shu Lin | 2025-09-09 |
| 12300575 | Semiconductor package and method | Chen-Hua Yu, Chuei-Tang Wang, Chien-Yuan Huang | 2025-05-13 |
| 12272616 | Heat-dissipating structures for semiconductor devices and methods of manufacture | Chen-Hua Yu, Tung-Liang Shao, Yu-Sheng Huang, Chuei-Tang Wang | 2025-04-08 |
| 12125824 | Semiconductor stack structure and manufacturing method thereof | Chuei-Tang Wang, Chien-Yuan Huang | 2024-10-22 |
| 12125812 | Integrated circuit packages and methods of forming the same | Chien-Yuan Huang, Chuei-Tang Wang, Chen-Hua Yu | 2024-10-22 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Chen-Hsiang Lao, Yuan Sheng Chiu, Hung-Chi Li, Tsung-Shu Lin | 2024-05-28 |
| 11676943 | Semiconductor structure and manufacturing method thereof | Chien-Yuan Huang, Tsung-Shu Lin | 2023-06-13 |
| 11594469 | Semiconductor device and method of manufacture | Hung-Chi Li, Tsung-Shu Lin, Tsung-Yu Chen, Wensen Hung | 2023-02-28 |
| 11587845 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Tsung-Yu Chen, Hung-Chi Li | 2023-02-21 |
| 11282766 | Package structure | Wensen Hung, Hung-Chi Li | 2022-03-22 |
| 11088048 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Tsung-Yu Chen, Hung-Chi Li | 2021-08-10 |
| 10978373 | Semiconductor device methods of manufacture | Hung-Chi Li, Tsung-Shu Lin, Tsung-Yu Chen, Wensen Hung | 2021-04-13 |
| 10515867 | Semiconductor structure and manufacturing method thereof | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Tsung-Yu Chen, Hung-Chi Li | 2019-12-24 |
| 7477515 | Electronic apparatus and thermal dissipating module thereof | Kuo-Ying Tsai | 2009-01-13 |
| 7355849 | Non-metal mesh cover for metal chassis | — | 2008-04-08 |
| 7248477 | Fan-shaped heat-dissipating device | I-Tseng Lee | 2007-07-24 |
| 7196904 | IC package with an implanted heat-dissipation fin | — | 2007-03-27 |
| 6914782 | Multi-opening heat-dissipation device for high-power electronic components | — | 2005-07-05 |