Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9870969 | Substrate | Yu-Ling Hsieh | 2018-01-16 | |
| 9214438 | Die-die stacking structure and method for making the same | Yi-Hsiu Liu | 2015-12-15 | |
| 8994191 | Die-die stacking structure and method for making the same | Yi-Hsiu Liu | 2015-03-31 | $1,927,000 |
| 7248477 | Fan-shaped heat-dissipating device | Shih-Chang Ku | 2007-07-24 | |
| 7143509 | Circuit board and processing method thereof | — | 2006-12-05 | |
| 6946601 | Electronic package with passive components | Jen-Te Tseng | 2005-09-20 | |
| 6919628 | Stack chip package structure | Hsueh-Kuo Liao, Jen-Te Tseng | 2005-07-19 |