Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412805 | Semiconductor package | Yuan Sheng Chiu, Hung-Chi Li, Shih-Chang Ku, Tsung-Shu Lin | 2025-09-09 |
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin +1 more | 2024-12-17 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Yuan Sheng Chiu, Hung-Chi Li, Shih-Chang Ku, Tsung-Shu Lin | 2024-05-28 |
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Wen-Hsin Wei, Hsien-Pin Hu | 2023-11-07 |
| 11715675 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin +1 more | 2023-08-01 |
| 11302600 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Tsung-Yu Chen +1 more | 2022-04-12 |
| 11062971 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Wen-Hsin Wei, Hsien-Pin Hu | 2021-07-13 |