| 12412805 |
Semiconductor package |
Chen-Hsiang Lao, Yuan Sheng Chiu, Shih-Chang Ku, Tsung-Shu Lin |
2025-09-09 |
| 11996342 |
Semiconductor package comprising heat dissipation plates |
Chen-Hsiang Lao, Yuan Sheng Chiu, Shih-Chang Ku, Tsung-Shu Lin |
2024-05-28 |
| 11594469 |
Semiconductor device and method of manufacture |
Shih-Chang Ku, Tsung-Shu Lin, Tsung-Yu Chen, Wensen Hung |
2023-02-28 |
| 11587845 |
Semiconductor structure |
Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen |
2023-02-21 |
| 11282766 |
Package structure |
Shih-Chang Ku, Wensen Hung |
2022-03-22 |
| 11088048 |
Semiconductor structure |
Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen |
2021-08-10 |
| 11018073 |
Heat spreading device and method |
Tsung-Shu Lin, Wensen Hung, Tsung-Yu Chen |
2021-05-25 |
| 10978373 |
Semiconductor device methods of manufacture |
Shih-Chang Ku, Tsung-Shu Lin, Tsung-Yu Chen, Wensen Hung |
2021-04-13 |
| 10879342 |
Multi-terminal inductor for integrated circuit |
Ching-Chung Hsu, Chung-Long Chang, Tsung-Yu Yang, Cheng-Chieh Hsieh, Che-Yung Lin +1 more |
2020-12-29 |
| 10672860 |
Multi-terminal inductor for integrated circuit |
Ching-Chung Hsu, Chung-Long Chang, Tsung-Yu Yang, Cheng-Chieh Hsieh, Che-Yung Lin +1 more |
2020-06-02 |
| 10515867 |
Semiconductor structure and manufacturing method thereof |
Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen |
2019-12-24 |
| 10475877 |
Multi-terminal inductor for integrated circuit |
Ching-Chung Hsu, Chung-Long Chang, Tsung-Yu Yang, Cheng-Chieh Hsieh, Che-Yung Lin +1 more |
2019-11-12 |
| 10461014 |
Heat spreading device and method |
Tsung-Shu Lin, Wensen Hung, Tsung-Yu Chen |
2019-10-29 |
| 10153218 |
Semiconductor structure and manufacturing method thereof |
Tsung-Yu Chen, Wensen Hung, Cheng-Chieh Hsieh, Tung-Liang Shao, Chih-Hang Tung |
2018-12-11 |
