Issued Patents All Time
Showing 1–25 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417959 | Integrated circuit device cooling using thermoresponsive materials | Rebecca Shia | 2025-09-16 |
| 12387988 | Method of manufacturing semiconductor package having lid structure | Tsung-Shu Lin, Wensen Hung | 2025-08-12 |
| 12354927 | Semiconductor device | Wensen Hung, Yih-Ting Shen, Jia-Syuan Li | 2025-07-08 |
| 12272612 | Semiconductor package module and manufacturing methods thereof | Wensen Hung | 2025-04-08 |
| 12191239 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Li-Han Hsu, Chien-Fu Tseng | 2025-01-07 |
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Wensen Hung, Yu-Ling Tsai, Chien-Chia Chiu | 2024-10-22 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Shu Lin, Wen-Hsin Wei | 2024-09-17 |
| 12074154 | Package structure | Tsung-Shu Lin, Wensen Hung | 2024-08-27 |
| 12051668 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2024-07-30 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11929293 | Semiconductor package with lid structure | Tsung-Shu Lin, Wensen Hung | 2024-03-12 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Shu Lin, Hsien-Pin Hu, Wen-Hsin Wei | 2024-03-05 |
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2023-11-07 |
| 11756870 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Li-Han Hsu, Chien-Fu Tseng | 2023-09-12 |
| 11721602 | Semiconductor package with stiffener structure | Wensen Hung, Yu-Ling Tsai, Chien-Chia Chiu | 2023-08-08 |
| 11715675 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11699674 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2023-07-11 |
| 11594469 | Semiconductor device and method of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Shu Lin, Wensen Hung | 2023-02-28 |
| 11587845 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Hung-Chi Li | 2023-02-21 |
| 11302600 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2022-04-12 |
| 11282825 | Package structure | Tsung-Shu Lin, Wensen Hung | 2022-03-22 |
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2021-08-24 |
| 11088079 | Package structure having line connected via portions | Chih-Kai Cheng, Tsung-Shu Lin, Hsien-Pin Hu, Wen-Hsin Wei | 2021-08-10 |
| 11088048 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Hung-Chi Li | 2021-08-10 |