Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12148719 | Forming large chips through stitching | Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen | 2024-11-19 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Shu Lin, Tsung-Yu Chen | 2024-09-17 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Hsien-Pin Hu | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Ping-Kang Huang, Chih-Ta Shen +5 more | 2024-04-23 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu | 2024-03-05 |
| 11888700 | Method and apparatus for fine-grained isolation in CN NSS domain of E2E network slice | Zhiyuan Hu, Jing PING, Zhigang Luo | 2024-01-30 |
| 11877147 | Methods, device and computer-readable medium for protecting MAC addresses | Zhiyuan Hu, Mingyu Zhao, Yueming Yin, Zhigang Luo | 2024-01-16 |
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Hsien-Pin Hu | 2023-11-07 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Ping-Kang Huang, Chih-Ta Shen +5 more | 2023-08-15 |
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-12-13 |
| 11520930 | Privacy protection for third party data sharing | Zhiyuan Hu, Xueqiang Yan, Zhigang Luo | 2022-12-06 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2022-09-27 |
| 11444038 | Forming large chips through stitching | Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen | 2022-09-13 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-08-16 |
| 11183399 | Semiconductor device and method of manufacture | Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-11-23 |
| 11101140 | Semiconductor device and method of manufacture | Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11088079 | Package structure having line connected via portions | Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu | 2021-08-10 |
| 11069657 | Chip package having die structures of different heights and method of forming same | Hsien-Pin Hu, Shang-Yun Hou | 2021-07-20 |
| 11062971 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Hsien-Pin Hu | 2021-07-13 |
| 10985137 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou | 2021-04-20 |
| 10964667 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou | 2021-03-30 |
| 10854567 | 3D packages and methods for forming the same | Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-12-01 |