Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2025-05-13 |
| 12266633 | Semiconductor structure and method of forming the same | Pu Wang, Li-Hui Cheng, An-Jhih Su, Szu-Wei Lu | 2025-04-01 |
| 12218117 | Method of forming package structure and package structure therefrom | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2025-02-04 |
| 12211818 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-01-28 |
| 12170236 | Method for forming package structure | Chih-Hao Chen, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2024-12-17 |
| 11942403 | Integrated circuit package and method | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2024-03-26 |
| 11901255 | Semiconductor device and method of forming the same | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2024-02-13 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2024-02-06 |
| 11855054 | Method of forming package structure | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2023-12-26 |
| 11804468 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2023-10-31 |
| 11742323 | Semiconductor structure and method of forming the same | Pu Wang, Li-Hui Cheng, An-Jhih Su, Szu-Wei Lu | 2023-08-29 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2023-05-30 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2023-04-11 |
| 11495526 | Integrated circuit package and method | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2022-11-08 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Wen-Hsin Wei | 2022-09-27 |
| 11424174 | Semiconductor device and method of forming the same | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2022-08-23 |
| 11302683 | Optical signal processing package structure | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2022-04-12 |
| 11239136 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2022-02-01 |
| 11205612 | Integrated circuit package and method | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2021-12-21 |
| 11121051 | Semiconductor packages and method of manufacturing the same | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2021-09-14 |
| 11062968 | Package structure and method for forming the same | Chih-Hao Chen, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2021-07-13 |
| 10796976 | Semiconductor device and method of forming the same | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2020-10-06 |
| 10535627 | Printing module, printing method and system of forming a printed structure | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai | 2020-01-14 |
| 10504824 | Integrated circuit package and method | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2019-12-10 |
| 10163848 | Semiconductor package | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai | 2018-12-25 |