Issued Patents All Time
Showing 1–25 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412802 | Heat dissipation structures for integrated circuit packages and methods of forming the same | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang | 2025-09-09 |
| 12368090 | Method of manufacturing semiconductor device including passivation layer | Jing-Cheng Lin, Po-Hao Tsai | 2025-07-22 |
| 12368084 | Package structure and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Szu-Wei Lu | 2025-07-22 |
| 12362260 | Methods of packaging semiconductor devices and packaged semiconductor devices | Po-Hao Tsai, Jing-Cheng Lin | 2025-07-15 |
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2025-05-13 |
| 12278162 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Szu-Wei Lu | 2025-04-15 |
| 12266633 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, An-Jhih Su, Szu-Wei Lu | 2025-04-01 |
| 12237291 | Dummy structure of stacked and bonded semiconductor device | Po-Hao Tsai, Jing-Cheng Lin | 2025-02-25 |
| 12230609 | Semiconductor packages | Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu | 2025-02-18 |
| 12224224 | Package structure with metallic layer over the surfaces of a plurality of semiconductor dies | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang | 2025-02-11 |
| 12218117 | Method of forming package structure and package structure therefrom | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2025-02-04 |
| 12211818 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Szu-Wei Lu | 2025-01-28 |
| 12176261 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2024-12-24 |
| 12170236 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2024-12-17 |
| 12132004 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Pu Wang, Szu-Wei Lu | 2024-10-29 |
| 12100640 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Szu-Wei Lu | 2024-09-24 |
| 12068173 | Package structure and manufacturing method thereof | Szu-Wei Lu, Ping-Yin Hsieh, Chih-Hao Chen | 2024-08-20 |
| 12057432 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Jui-Pin Hung, Jing-Cheng Lin | 2024-08-06 |
| 12033912 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Pu Wang, Szu-Wei Lu | 2024-07-09 |
| 11996345 | Package structure and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Szu-Wei Lu | 2024-05-28 |
| 11973005 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Szu-Wei Lu | 2024-04-30 |
| 11942403 | Integrated circuit package and method | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2024-03-26 |
| 11923259 | Package structure and method of manufacturing the same | Pu Wang, Szu-Wei Lu, Tsung-Fu Tsai | 2024-03-05 |
| 11901255 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2024-02-13 |
| 11894287 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2024-02-06 |