Issued Patents All Time
Showing 26–50 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869822 | Semiconductor package and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang | 2024-01-09 |
| 11855054 | Method of forming package structure | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2023-12-26 |
| 11855003 | Package structure and method of fabricating the same | Pu Wang, Szu-Wei Lu, Hsien-Ju Tsou | 2023-12-26 |
| 11830821 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Pu Wang, Szu-Wei Lu | 2023-11-28 |
| 11804468 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Szu-Wei Lu | 2023-10-31 |
| 11756855 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2023-09-12 |
| 11756802 | Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device | Jing-Cheng Lin, Po-Hao Tsai | 2023-09-12 |
| 11742323 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, An-Jhih Su, Szu-Wei Lu | 2023-08-29 |
| 11705381 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Szu-Wei Lu | 2023-07-18 |
| 11699597 | Package structure and manufacturing method thereof | Szu-Wei Lu, Ping-Yin Hsieh, Chih-Hao Chen | 2023-07-11 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2023-05-30 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2023-04-11 |
| 11605579 | Semiconductor device having passivation layer and method of manufacturing the same | Jing-Cheng Lin, Po-Hao Tsai | 2023-03-14 |
| 11527418 | Integrated circuit packages and methods of forming same | Jing-Cheng Lin, Po-Hao Tsai | 2022-12-13 |
| 11521905 | Package structure and method of manufacturing the same | Pu Wang, Szu-Wei Lu, Tsung-Fu Tsai | 2022-12-06 |
| 11495526 | Integrated circuit package and method | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2022-11-08 |
| 11488843 | Underfill between a first package and a second package | Jing-Cheng Lin, Po-Hao Tsai | 2022-11-01 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Chin-Fu Kao, Szu-Wei Lu, Wen-Hsin Wei, Chih-Chien Pan | 2022-09-27 |
| 11424174 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2022-08-23 |
| 11393783 | Dummy structure of stacked and bonded semiconductor device | Po-Hao Tsai, Jing-Cheng Lin | 2022-07-19 |
| 11302683 | Optical signal processing package structure | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2022-04-12 |
| 11296051 | Semiconductor packages and forming method thereof | Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu | 2022-04-05 |
| 11239134 | Package structure and method of fabricating the same | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2022-02-01 |
| 11239136 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2022-02-01 |
| 11239138 | Methods of packaging semiconductor devices and packaged semiconductor devices | Po-Hao Tsai, Jing-Cheng Lin | 2022-02-01 |