Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148733 | Shift control method in manufacture of semiconductor device | Chih-Wei Wu, Ying-Ching Shih | 2024-11-19 |
| 11855003 | Package structure and method of fabricating the same | Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2023-12-26 |
| 11456245 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2022-09-27 |
| 11296032 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2022-04-05 |
| 11205615 | Semiconductor device and method of manufacture | Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2021-12-21 |
| 11183482 | Shift control method in manufacture of semiconductor device | Chih-Wei Wu, Ying-Ching Shih | 2021-11-23 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Kuo-Chiang Ting, Szu-Wei Lu +3 more | 2021-11-02 |
| 11139285 | Semiconductor package | Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2021-10-05 |
| 10916450 | Package of integrated circuits having a light-to-heat-conversion coating material | Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin | 2021-02-09 |
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo +3 more | 2020-12-29 |
| 10586763 | Semiconductor device and method of manufacture | Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2020-03-10 |
| 10510732 | PoP device and method of forming the same | Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2019-12-17 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-03 |
| 10269589 | Method of manufacturing a release film as isolation film in package | Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin | 2019-04-23 |