Issued Patents All Time
Showing 1–25 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400878 | Integrated circuit package and method | Shih-Ting Lin, Szu-Wei Lu, Shang-Yun Hou, Chi-Hsi Wu, Weiming Chris Chen | 2025-08-26 |
| 12392961 | Structure and process for photonic packages | Chen-Hua Yu, Hsing-Kuo Hsia | 2025-08-19 |
| 12362291 | Semiconductor device and method | Sung-Feng Yeh, Ta Hao Sung, Ming-Zhi Yang, Gao-Long Wu | 2025-07-15 |
| 12334464 | Encapsulated package including device dies connected via interconnect die | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2025-06-17 |
| 12327781 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more | 2025-06-10 |
| 12322729 | Semiconductor device | Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou, Chi-Hsi Wu | 2025-06-03 |
| 12322673 | 3DIC with heat dissipation structure and warpage control | Sung-Feng Yeh, Ta Hao Sung, Jian-Wei Hong | 2025-06-03 |
| 12315786 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more | 2025-05-27 |
| 12259578 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Chen-Hua Yu, Shang-Yun Hou | 2025-03-25 |
| 12253729 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou +1 more | 2025-03-18 |
| 12242108 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2025-03-04 |
| 12135454 | Structure and process for photonic packages | Chen-Hua Yu, Hsing-Kuo Hsia | 2024-11-05 |
| 12080638 | Semiconductor device and method for manufacturing the same | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou | 2024-08-13 |
| 12038599 | Photonic package and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Jiun Yi Wu, Hung-Yi Kuo, Shang-Yun Hou | 2024-07-16 |
| 12033898 | Method of fabricating a FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuang-Hsin Chen | 2024-07-09 |
| 12027455 | Chip-on-wafer structure with Chiplet Interposer | Weiming Chris Chen, Shang-Yun Hou | 2024-07-02 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Weiming Chris Chen, Hsien-Pin Hu, Wen-Chih Chiou, Chen-Hua Yu | 2024-05-28 |
| 11980015 | SRAM cell and logic cell design | Fang Chen, Jhon Jhy Liaw, Min-Chang Liang | 2024-05-07 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2024-05-07 |
| 11852868 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2023-12-26 |
| 11747563 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Chen-Hua Yu, Shang-Yun Hou | 2023-09-05 |
| 11728238 | Semiconductor package with heat dissipation films and manufacturing method thereof | Ting-Yu Yeh, Cing-He Chen, Weiming Chris Chen, Chia-Hao Hsu | 2023-08-15 |
| 11592618 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Chen-Hua Yu, Shang-Yun Hou | 2023-02-28 |
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2022-12-20 |