Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508696 | Semiconductor device | Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-22 |
| 11508737 | SRAM cell and logic cell design | Fang Chen, Jhon Jhy Liaw, Min-Chang Liang | 2022-11-22 |
| 11493689 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-08 |
| 11476184 | Semiconductor device and method for manufacturing the same | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2022-10-18 |
| 11462418 | Integrated circuit package and method | Shih-Ting Lin, Szu-Wei Lu, Weiming Chris Chen, Shang-Yun Hou, Chi-Hsi Wu | 2022-10-04 |
| 11454773 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou +1 more | 2022-09-27 |
| 11380611 | Chip-on-wafer structure with chiplet interposer | Weiming Chris Chen, Shang-Yun Hou | 2022-07-05 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Szu-Wei Lu, Shang-Yun Hou +3 more | 2021-11-02 |
| 11156772 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Pin-Tso Lin, Sung-Hui Huang, Shang-Yun Hou +1 more | 2021-10-26 |
| 11139282 | Semiconductor package structure and method for manufacturing the same | Tu-Hao Yu, Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Wan-Yu Lee +1 more | 2021-10-05 |
| 10978352 | FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuang-Hsin Chen | 2021-04-13 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou +1 more | 2020-12-15 |
| 10867954 | Interconnect chips | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-12-15 |
| 10746923 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Pin-Tso Lin, Sung-Hui Huang, Shang-Yun Hou +1 more | 2020-08-18 |
| 10720436 | SRAM cell and logic cell design | Fang Chen, Jhon Jhy Liaw, Min-Chang Liang | 2020-07-21 |
| 10720401 | Interconnect chips | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-07-21 |
| 10546786 | Method of fabricating a FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuang-Hsin Chen | 2020-01-28 |
| 10515869 | Semiconductor package structure having a multi-thermal interface material structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou | 2019-12-24 |
| 10515888 | Semiconductor device and method for manufacturing the same | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2019-12-24 |
| 10510722 | Semiconductor device and method for manufacturing the same | Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou, Chi-Hsi Wu | 2019-12-17 |
| 10468418 | SRAM cell and logic cell design | Fang Chen, Jhon Jhy Liaw, Min-Chang Liang | 2019-11-05 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Ting-Yu Yeh, Chia-Hsin Chen, Tu-Hao Yu, Shang-Yun Hou +1 more | 2019-05-28 |
| 10170457 | COWOS structures and method of forming the same | Wei-Ming Chen, Tu-Hao Yu, Shang-Yun Hou, Chi-Hsi Wu | 2019-01-01 |
| 10062614 | FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuang-Hsin Chen | 2018-08-28 |
| 10050042 | SRAM cell and logic cell design | Fang Chen, Jhon Jhy Liaw, Min-Chang Liang | 2018-08-14 |