Issued Patents All Time
Showing 1–25 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191401 | Manufacturing method for semiconductor structure having a plurality of fins | Chia-Ming Hsu, Yi-Jing Li, Chih-Hsin Ko, Da-Wen Lin, Clement Hsingjen Wann | 2025-01-07 |
| 12033898 | Method of fabricating a FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuo-Chiang Ting | 2024-07-09 |
| 11916151 | Semiconductor structure having fin with all around gate | Chia-Ming Hsu, Yi-Jing Li, Chih-Hsin Ko, Da-Wen Lin, Clement Hsingjen Wann | 2024-02-27 |
| 11469144 | Semiconductor arrangement with fin features having different heights | Tsung-Yu Chiang, Hsin-Lung Chao, Chen Chu-Hsuan | 2022-10-11 |
| 11158739 | Semiconductor structure having field plate and associated fabricating method | Chih-Chang Cheng, Fu-Yu Chu, Ruey-Hsin Liu, Chih-Hsin Ko, Shih-Fen Huang | 2021-10-26 |
| 11011419 | Method for forming interconnect structure | Bor-Zen Tien, Jhu-Ming Song, Hsuan-Han Lin, Mu-Yi Lin, Tzong-Sheng Chang | 2021-05-18 |
| 10978352 | FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuo-Chiang Ting | 2021-04-13 |
| 10930583 | Capacitor embedded with nanocrystals | Cheng-Chieh Lai, Meng-Ting Yu, Yung-Hsien Wu | 2021-02-23 |
| 10840143 | Methods for forming a semiconductor arrangement of fins having multiple heights and an alignment mark | Tsung-Yu Chiang, Hsin-Lung Chao, Chen Chu-Hsuan | 2020-11-17 |
| 10629481 | Method for forming interconnect structure | Bor-Zen Tien, Jhu-Ming Song, Hsuan-Han Lin, Mu-Yi Lin, Tzong-Sheng Chang | 2020-04-21 |
| 10546786 | Method of fabricating a FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuo-Chiang Ting | 2020-01-28 |
| 10361085 | Fin field effect transistor (finFET) device structure with ultra-thin body and method for forming the same | Cheng-Chieh Lai, Yung-Chun Wu, Mu-Shih Yeh | 2019-07-23 |
| 10347766 | Semiconductor device and method of fabricating the same | Wei-Shuo Ho, Chia-Ming Chang, Tsung-Yu Chiang, Bor-Zen Tien | 2019-07-09 |
| 10319675 | Capacitor embedded with nanocrystals | Cheng-Chieh Lai, Meng-Ting Yu, Yung-Hsien Wu | 2019-06-11 |
| 10249562 | Package structure and fabrication method thereof | Ching-Wen Chiang, Hsien-Wen Chen | 2019-04-02 |
| 10205024 | Semiconductor structure having field plate and associated fabricating method | Chih-Chang Cheng, Fu-Yu Chu, Ruey-Hsin Liu, Chih-Hsin Ko, Shih-Fen Huang | 2019-02-12 |
| 10199320 | Method of fabricating electronic package | Ching-Wen Chiang, Sheng-Li Lu, Hsien-Wen Chen | 2019-02-05 |
| 10177036 | Semiconductor arrangement with fins having multiple heights and a dielectric layer recessed in the substrate | Tsung-Yu Chiang, Hsin-Lung Chao, Chen Chu-Hsuan | 2019-01-08 |
| 10163516 | Semiconductor device structure | I-Chen Huang, Yung-Hsien Wu, Wen-Chao Shen | 2018-12-25 |
| 10134626 | Mechanisms for forming FinFETs with different fin heights | Tsung-Yu Chiang, Chung-Wei Lin, Bor-Zen Tien | 2018-11-20 |
| 10068984 | Method of manufacturing high-k dielectric using HfO/Ti/Hfo layers | I-Chen Huang, Yi-Ju Hsu, Chi-Wen Liu, Yung-Hsien Wu, Chin-Yu Chen | 2018-09-04 |
| 10062614 | FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuo-Chiang Ting | 2018-08-28 |
| 10056299 | Metal gate structure and manufacturing method thereof | Wei-Shuo Ho, Tsung-Yu Chiang | 2018-08-21 |
| 10049973 | Electronic package and fabrication method thereof and substrate structure | Ching-Wen Chiang, Hsien-Wen Chen | 2018-08-14 |
| 10008494 | Semiconductor component and method for fabricating the same | Cheng-Chieh Lai, Shih-Kai Fan, Yung-Hsien Wu, Yu-Hsun Chen | 2018-06-26 |