Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374794 | Antenna-in-package construction with frequency division duplex technology | Huan-Ta Chen, Chung-Lien Ho, Chin Pin Chen | 2025-07-29 |
| 10886593 | Structure of integrated radio frequency multi-chip package and method of fabricating the same | Yen-Cheng Kuan, Chia-Jen Liang | 2021-01-05 |
| 10707835 | Wireless receiving device | Chia-Jen Liang, Yen-Cheng Kuan, Mau-Chung Frank Chang | 2020-07-07 |
| 10566299 | Method for manufacturing a multi-band antenna package structure | Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu | 2020-02-18 |
| 10424550 | Multi-band antenna package structure, manufacturing method thereof and communication device | Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu | 2019-09-24 |
| 10361154 | Variable inductor and integrated circuit using the variable inductor | Chia-Jen Liang, Yen-Cheng Kuan, Chien-Te Yu | 2019-07-23 |
| 10298182 | Radio frequency amplifier and integrated circuit using the radio frequency amplifier | Chia-Jen Liang, Yen-Cheng Kuan, Hung-Ting Chou | 2019-05-21 |
| 10277170 | Radio frequency amplifier and integrated circuit using the radio frequency amplifier | Chia-Jen Liang, Yen-Cheng Kuan, Hung-Ting Chou | 2019-04-30 |
| 10249562 | Package structure and fabrication method thereof | Kuang-Hsin Chen, Hsien-Wen Chen | 2019-04-02 |
| 10236227 | Electronic package and fabrication method thereof | Lung-Shan Chuang, Tzung-Yen Wu, Chun-Hung Lu | 2019-03-19 |
| 10199345 | Method of fabricating substrate structure | Hsin-Ta Lin | 2019-02-05 |
| 10199320 | Method of fabricating electronic package | Kuang-Hsin Chen, Sheng-Li Lu, Hsien-Wen Chen | 2019-02-05 |
| 10096541 | Method for fabricating electronic package | Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen | 2018-10-09 |
| 10096558 | Multi-band antenna package structure, manufacturing method thereof and communication device | Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu | 2018-10-09 |
| 10049973 | Electronic package and fabrication method thereof and substrate structure | Kuang-Hsin Chen, Hsien-Wen Chen | 2018-08-14 |
| 9899344 | Substrate structure, fabrication method thereof and conductive structure | Hsin-Ta Lin | 2018-02-20 |
| 9818683 | Electronic package and method of fabricating the same | Kuang-Hsin Chen, Sheng-Li Lu, Hsien-Wen Chen | 2017-11-14 |
| 9754868 | Substrate structure, electronic package and method for fabricating the electronic package | Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen | 2017-09-05 |
| 9748183 | Fabrication method of semiconductor package | Cheng-Hao Ciou, Cheng-Chieh Wu, Kuang-Hsin Chen, Hsien-Wen Chen | 2017-08-29 |
| 9627307 | Semiconductor package and fabrication method thereof | Cheng-Hao Ciou, Cheng-Chieh Wu, Kuang-Hsin Chen, Hsien-Wen Chen | 2017-04-18 |
| 9196596 | Interposer and method of manufacturing the same | Kuang-Hsin Chen, Wei-Jen Chang, Hsien-Wen Chen | 2015-11-24 |