Issued Patents All Time
Showing 1–25 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406686 | Techniques for training a multitask learning model to assess perceived audio quality | Phillip A. Williams, William Francis Wolcott, IV | 2025-09-02 |
| 12368132 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2025-07-22 |
| 12361956 | Perceptually-based loss functions for audio encoding and decoding based on machine learning | Roy M. Fejgin, Grant A. Davidson, Vivek Kumar | 2025-07-15 |
| 12347739 | Package structure | Ying-Ching Shih, Wen-Chih Chiou | 2025-07-01 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2025-04-08 |
| 12250002 | Analog digital converter | Po-Hua Chen, Yu-Yee Liow, Wen-Hong Hsu, Hsuan Chih Yeh, Pei-Wen Sun | 2025-03-11 |
| 12237402 | Methods of forming semiconductor devices | Shu-Wei Hsu, Yu-Jen Shen, Hao-Yun Cheng, Ying-Tsung Chen, Ying-Ho Chen | 2025-02-25 |
| 12230605 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2025-02-18 |
| 12183681 | Package structure having bridge structure for connection between semiconductor dies | Ying-Ching Shih | 2024-12-31 |
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2024-11-19 |
| 12148733 | Shift control method in manufacture of semiconductor device | Ying-Ching Shih, Hsien-Ju Tsou | 2024-11-19 |
| 12131488 | Electronic apparatus and method used for object tracking | Chien-Hao Chen, Chao-Hsun Yang, Shih-Tse Chen | 2024-10-29 |
| 12125306 | Method and apparatus for person re-identification | Chien-Hao Chen, Chao-Hsun Yang, Shih-Tse Chen | 2024-10-22 |
| 12087727 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2024-09-10 |
| 12074119 | Chip package structure | Jiun-Ting Chen, Ying-Ching Shih, Szu-Wei Lu | 2024-08-27 |
| 12033978 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2024-07-09 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su, Szu-Wei Lu +2 more | 2024-07-09 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2024-05-21 |
| 11990429 | Dummy die placement without backside chipping | Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu | 2024-05-21 |
| 11955459 | Package structure | Shu-Hang Liao, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2024-04-09 |
| 11924481 | Automated workflows from media asset differentials | Yadong Wang, Kyle Tacke, Shilpa Jois Rao, Boney Sekh, Andrew Swan +1 more | 2024-03-05 |
| 11824040 | Package component, electronic device and manufacturing method thereof | Szu-Wei Lu, Ying-Ching Shih | 2023-11-21 |
| 11817111 | Perceptually-based loss functions for audio encoding and decoding based on machine learning | Roy M. Fejgin, Grant A. Davidson, Vivek Kumar | 2023-11-14 |
| 11810831 | Integrated circuit package and method of forming same | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2023-11-07 |
| 11749607 | Package and method of manufacturing the same | Chen-Hua Yu, Kuo-Chung Yee, Szu-Wei Lu, Ying-Ching Shih | 2023-09-05 |