Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237402 | Methods of forming semiconductor devices | Shu-Wei Hsu, Yu-Jen Shen, Hao-Yun Cheng, Chih-Wei Wu, Ying-Tsung Chen | 2025-02-25 |
| 11756838 | Replacement gate process for semiconductor devices | Yu-Jen Shen, Yung-Cheng Lu | 2023-09-12 |
| 11515403 | Semiconductor device and method | Shu-Wei Hsu, Yu-Jen Shen, Hao-Yun Cheng, Chih-Wei Wu, Ying-Tsung Chen | 2022-11-29 |
| 11081402 | Replacement gate process for semiconductor devices | Yu-Jen Shen, Yung-Cheng Lu | 2021-08-03 |
| 10515860 | Replacement gate process for semiconductor devices | Yu-Jen Shen, Yung-Cheng Lu | 2019-12-24 |
| 10068992 | Semiconductor device including fin FET and manufacturing method thereof | Hung-Kun LO, Tzu-Hsiang Hsu, Chia-Jung Hsu, Feng-Cheng Yang, Teng-Chun Tsai | 2018-09-04 |
| 9917017 | Replacement gate process for semiconductor devices | Yu-Jen Shen, Yung-Cheng Lu | 2018-03-13 |
| 9680017 | Semiconductor device including Fin FET and manufacturing method thereof | Hung-Kun LO, Chia-Jung Hsu, Teng-Chun Tsai, Tzu-Hsiang Hsu, Feng-Cheng Yang | 2017-06-13 |
| 9679782 | Planarization method, method for manufacturing semiconductor structure, and semiconductor structure | Yu-Ting Yen | 2017-06-13 |
| 9337066 | Wafer cleaning module | Yu-Ting Yen, Kao-Feng Liao | 2016-05-10 |
| 7416648 | Image sensor system for monitoring condition of electrode for electrochemical process tools | Wen-Chih Chiou, Cheng-Hsun Chan | 2008-08-26 |
| 7407601 | Polymeric particle slurry system and method to reduce feature sidewall erosion | Shen-Nan Lee, Syun-Ming Jang, Tzu-Jen Chou | 2008-08-05 |
| 7297632 | Scratch reduction for chemical mechanical polishing | Chuang-Ping Hou, Syun-Ming Jang, Chu-Yun Fu, Tung-Ching Tseng | 2007-11-20 |
| 7232362 | Chemical mechanical polishing process for manufacturing semiconductor devices | Wen-Chih Chiou, Chen-Hua Yu | 2007-06-19 |
| 6946397 | Chemical mechanical polishing process with reduced defects in a copper process | William Weilun Hong, Chia-Che CHUNG, Chi-Wei Chung, Wen-Chih Chiou, Syun-Ming Jang | 2005-09-20 |
| 6930040 | Method of forming a contact on a silicon-on-insulator wafer | Chuan-Ping Hou, Syun-Ming Jang, Tung-Ching Tseng | 2005-08-16 |
| 6924238 | Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance | Tzu-Jen Chou, Syun-Ming Jang, Shen-Nan Lee | 2005-08-02 |
| 6919276 | Method to reduce dishing and erosion in a CMP process | Shen-Nan Lee, Syun-Ming Jang, Tzu-Jen Chou, Jin-Yiing Song | 2005-07-19 |
| 6887790 | Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity | Tien-I Bao, Bi-Trong Chen | 2005-05-03 |
| 6869858 | Shallow trench isolation planarized by wet etchback and chemical mechanical polishing | Syun-Ming Jang | 2005-03-22 |
| 6806184 | Method to eliminate copper hillocks and to reduce copper stress | Syun-Ming Jang | 2004-10-19 |
| 6753249 | Multilayer interface in copper CMP for low K dielectric | Jih-Churng Twu, Weng Chang | 2004-06-22 |
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Wen-Chih Chiou, Tsu Shih, Syun-Ming Jang | 2004-05-18 |
| 6733373 | Polishing assembly for a linear chemical mechanical polishing apparatus and method for forming | Chia-Ming Yang, Chin-Hsin Peng, Jian-Lin Hwang | 2004-05-11 |
| 6634930 | Method and apparatus for preventing metal corrosion during chemical mechanical polishing | Wen-Chih Chiou, Tsu Shih, Syun-Ming Jang, Chia-Ming Yang | 2003-10-21 |