Issued Patents All Time
Showing 1–25 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424438 | Low-k dielectric and processes for forming same | Chia-Cheng Chou, Po-Cheng Shih, Li Chun Te | 2025-09-23 |
| 12369390 | Method for forming semiconductor structure with high aspect ratio | Han-Pin Chung, Chih-Tang Peng | 2025-07-22 |
| 12308238 | Method and structure for semiconductor device having gate spacer protection layer | Chih Wei Lu, Chung-Ju Lee, Hai-Ching Chen, Chien-Hua Huang | 2025-05-20 |
| 12300486 | System and method of forming a porous low-k structure | Bo-Jiun Lin, Hai-Ching Chen | 2025-05-13 |
| 12261121 | Structure and method for a low-k dielectric with pillar-type air-gaps | Chih Wei Lu, Chung-Ju Lee | 2025-03-25 |
| 12170199 | Cyclic spin-on coating process for forming dielectric material | Je-Ming Kuo, Yen-Chun Huang, Chih-Tang Peng | 2024-12-17 |
| 12087861 | FinFETs and methods of forming FinFETs | Chin-Hsiang Lin, Tai-Chun Huang | 2024-09-10 |
| 11984316 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Ching-Yu Chang, Hai-Ching Chen | 2024-05-14 |
| 11955376 | Etch damage and ESL free dual damascene metal interconnect | Sunil Kumar Singh, Chung-Ju Lee | 2024-04-09 |
| 11929258 | Via connection to a partially filled trench | Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Chung-Ju Lee +1 more | 2024-03-12 |
| 11854820 | Spacer etching process for integrated circuit design | Ru-Gun Liu, Cheng-Hsiung Tsai, Chung-Ju Lee, Chih-Ming Lai, Chia-Ying Lee +6 more | 2023-12-26 |
| 11855182 | Low-k gate spacer and methods for forming the same | Wen-Kai Lin, Bo-Yu Lai, Li Chun Te, Kai-Hsuan Lee, Sai-Hooi Yeong +1 more | 2023-12-26 |
| 11830808 | Semiconductor structure and method making the same | Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen | 2023-11-28 |
| 11823960 | Method for forming semiconductor structure with high aspect ratio | Han-Pin Chung, Chih-Tang Peng | 2023-11-21 |
| 11791154 | Cyclic spin-on coating process for forming dielectric material | Je-Ming Kuo, Yen-Chun Huang, Chih-Tang Peng | 2023-10-17 |
| 11728271 | Structure and method for a low-K dielectric with pillar-type air-gaps | Chih Wei Lu, Chung-Ju Lee | 2023-08-15 |
| 11658120 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Ching-Yu Chang, Hai-Ching Chen | 2023-05-23 |
| 11637010 | System and method of forming a porous low-k structure | Bo-Jiun Lin, Hai-Ching Chen | 2023-04-25 |
| 11569124 | Interconnect structure having an etch stop layer over conductive lines | Cheng-Hsiung Tsai, Chung-Ju Lee, Shau-Lin Shue | 2023-01-31 |
| 11532552 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Hai-Ching Chen, Jung-Hsun Tsai, Shau-Lin Shue | 2022-12-20 |
| 11495465 | Method and structure for semiconductor device having gate spacer protection layer | Chih Wei Lu, Chung-Ju Lee, Hai-Ching Chen, Chien-Hua Huang | 2022-11-08 |
| 11450526 | Cyclic spin-on coating process for forming dielectric material | Je-Ming Kuo, Yen-Chun Huang, Chih-Tang Peng | 2022-09-20 |
| 11411113 | FinFETs and methods of forming FinFETs | Chin-Hsiang Lin, Tai-Chun Huang | 2022-08-09 |
| 11328991 | Semiconductor structure and method making the same | Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen | 2022-05-10 |
| 11287048 | Flow control valve by bending a pipeline | — | 2022-03-29 |