Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327792 | Semiconductor structure and manufacturing methods thereof | Tung Ying Lee | 2025-06-10 |
| 12300486 | System and method of forming a porous low-k structure | Hai-Ching Chen, Tien-I Bao | 2025-05-13 |
| 12249574 | Interconnect structure of semiconductor device and method of forming same | Tung Ying Lee | 2025-03-11 |
| 12142521 | Interconnect structure and semiconductor device having the same | Tung Ying Lee, Yu-Chao Lin | 2024-11-12 |
| 12094771 | Interconnect structure and method | Yu-Chao Lin, Tung Ying Lee | 2024-09-17 |
| 11984316 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2024-05-14 |
| 11957070 | Semiconductor device, memory cell and method of forming the same | Tung Ying Lee, Shao-Ming Yu, Yu-Chao Lin | 2024-04-09 |
| 11658120 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2023-05-23 |
| 11637010 | System and method of forming a porous low-k structure | Hai-Ching Chen, Tien-I Bao | 2023-04-25 |
| 11456211 | Method of forming interconnect structure | Tung Ying Lee, Yu-Chao Lin | 2022-09-27 |
| 11450563 | Interconnect structure and method | Yu-Chao Lin, Tung Ying Lee | 2022-09-20 |
| 10867922 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2020-12-15 |
| 10679846 | System and method of forming a porous low-K structure | Hai-Ching Chen, Tien-I Bao | 2020-06-09 |
| 10008382 | Semiconductor device having a porous low-k structure | Hai-Ching Chen, Tien-I Bao | 2018-06-26 |
| 9941157 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2018-04-10 |
| 9905457 | High boiling temperature solvent additives for semiconductor processing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2018-02-27 |
| 9709905 | System and method for dark field inspection | Hai-Ching Chen, Hsin-Chieh Yao, Tien-I Bao | 2017-07-18 |
| 9627256 | Integrated circuit interconnects and methods of making same | Cheng-Hsiung Tsai, Chung-Ju Lee, Hsien-Chang Wu | 2017-04-18 |
| 9134633 | System and method for dark field inspection | Hsin-Chieh Yao, Hai-Ching Chen, Tien-I Bao | 2015-09-15 |
| 8836127 | Interconnect with flexible dielectric layer | Ching-Yu Lo, Hai-Ching Chen, Tien-I Bao, Shau-Lin Shue, Chen-Hua Yu | 2014-09-16 |
| 8736014 | High mechanical strength additives for porous ultra low-k material | Ching-Yu Lo, Hai-Ching Chen, Tien-I Bao, Chen-Hua Yu | 2014-05-27 |