Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424488 | Dual etch-stop layer structure | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2025-09-23 |
| 12406924 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2025-09-02 |
| 12362231 | Self-assembled dielectric on metal rie lines to increase reliability | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Yu-Teng Dai, Chung-Ju Lee | 2025-07-15 |
| 12322723 | Self-aligned interconnect structure | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao | 2025-06-03 |
| 12315817 | Dielectric on wire structure to increase processing window for overlying via | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao | 2025-05-27 |
| 12300541 | Structure and formation method of semiconductor device with carbon-containing conductive structure | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Hwei-Jay CHU | 2025-05-13 |
| 12300611 | Interconnect conductive structure comprising two conductive materials | Yu-Teng Dai, Hsi-Wen Tien, Wei-Hao Liao, Chih Wei Lu, Chung-Ju Lee | 2025-05-13 |
| 12266565 | Integrated chip with an etch-stop layer forming a cavity | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Shau-Lin Shue, Yu-Teng Dai +1 more | 2025-04-01 |
| 12243775 | Double patterning approach by direct metal etch | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2025-03-04 |
| 12125795 | Integrated chip with inter-wire cavities | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai +2 more | 2024-10-22 |
| 12094823 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2024-09-17 |
| 11972975 | Semiconductor device structure having air gap and method for forming the same | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee +1 more | 2024-04-30 |
| 11942364 | Selective deposition of a protective layer to reduce interconnect structure critical dimensions | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Yu-Teng Dai, Wei-Hao Liao | 2024-03-26 |
| 11923293 | Barrier structure on interconnect wire to increase processing window for overlying via | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai | 2024-03-05 |
| 11854965 | Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability | Yu-Teng Dai, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao | 2023-12-26 |
| 11842966 | Integrated chip with inter-wire cavities | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai +2 more | 2023-12-12 |
| 11842924 | Dual etch-stop layer structure | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2023-12-12 |
| 11798910 | Self-aligned interconnect structure | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao | 2023-10-24 |
| 11798840 | Self-assembled dielectric on metal RIE lines to increase reliability | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Yu-Teng Dai, Chung-Ju Lee | 2023-10-24 |
| 11756884 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2023-09-12 |
| 11688782 | Semiconductor structure and method for forming the same | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Yu-Teng Dai, Chung-Ju Lee | 2023-06-27 |
| 11676862 | Semiconductor device structure and methods of forming the same | Hwei-Jay CHU, Chieh-Han Wu, Cheng-Hsiung Tsai, Chung-Ju Lee | 2023-06-13 |
| 11652054 | Dielectric on wire structure to increase processing window for overlying via | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao | 2023-05-16 |
| 11569127 | Double patterning approach by direct metal etch | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Chung-Ju Lee | 2023-01-31 |
| 11521896 | Selective deposition of a protective layer to reduce interconnect structure critical dimensions | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Yu-Teng Dai, Wei-Hao Liao | 2022-12-06 |