Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488926 | Self-aligned interconnect structure | Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao | 2022-11-01 |
| 11482447 | Method of forming an integrated chip having a cavity between metal features | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Shau-Lin Shue, Yu-Teng Dai +1 more | 2022-10-25 |
| 11362030 | Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability | Yu-Teng Dai, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao | 2022-06-14 |
| 11139236 | Semiconductor devices and methods of forming the same | Hsi-Wen Tien, Wei-Hao Liao, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee | 2021-10-05 |
| 10847417 | Methods of forming interconnect structures in semiconductor fabrication | Chung-Ju Lee | 2020-11-24 |
| 10170306 | Method of double patterning lithography process using plurality of mandrels for integrated circuit applications | Chung-Ju Lee, Shau-Lin Shue, Tien-I Bao, Yung-Hsu Wu | 2019-01-01 |
| 9709905 | System and method for dark field inspection | Bo-Jiun Lin, Hai-Ching Chen, Tien-I Bao | 2017-07-18 |
| 9627206 | Method of double patterning lithography process using plurality of mandrels for integrated circuit applications | Chung-Ju Lee, Shau-Lin Shue, Tien-I Bao, Yung-Hsu Wu | 2017-04-18 |
| 9589890 | Method for interconnect scheme | Carlos H. Diaz, Cheng-Hsiung Tsai, Chung-Ju Lee, Chien-Hua Huang, Hsi-Wen Tien +3 more | 2017-03-07 |
| 9490163 | Tapered sidewall conductive lines and formation thereof | Chien-Hua Huang, Chung-Ju Lee | 2016-11-08 |
| 9484257 | Semiconductor devices and methods of manufacture thereof | Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue | 2016-11-01 |
| 9478430 | Method of semiconductor integrated circuit fabrication | Cheng-Hsiung Tsai, Chung-Ju Lee, Tien-I Bao | 2016-10-25 |
| 9349595 | Methods of manufacturing semiconductor devices | Cheng-Hsiung Tsai, Chung-Ju Lee, Tien-I Bao | 2016-05-24 |
| 9330989 | System and method for chemical-mechanical planarization of a metal layer | Yung-Hsu Wu, Shih-Kang Fu, Hsiang-Huan Lee, Chung-Ju Lee, Hai-Ching Chen +1 more | 2016-05-03 |
| 9293413 | Semiconductor devices and methods of manufacture thereof | Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue | 2016-03-22 |
| 9275960 | Integrated circuit formed using spacer-like copper deposition | Cheng-Hsiung Tsai, Chung-Ju Lee, Hsiang-Huan Lee | 2016-03-01 |
| 9214347 | Overlay mark assistant feature | Hsien-Cheng Wang, Huang Chien Kai, Chun-Kuang Chen | 2015-12-15 |
| 9209076 | Method of double patterning lithography process using plurality of mandrels for integrated circuit applications | Chung-Ju Lee, Yung-Hsu Wu, Tien-I Bao, Shau-Lin Shue | 2015-12-08 |
| 9134604 | Extreme ultraviolet (EUV) mask and method of fabricating the EUV mask | Chih-Tsung Shih, Shinn-Sheng Yu, Jeng-Horng Chen, Chung-Ju Lee, Anthony Yen | 2015-09-15 |
| 9134633 | System and method for dark field inspection | Bo-Jiun Lin, Hai-Ching Chen, Tien-I Bao | 2015-09-15 |
| 9093501 | Interconnection wires of semiconductor devices | Sunil Kumar Singh, Chung-Ju Lee, Hsiang-Huan Lee | 2015-07-28 |
| 9040417 | Semiconductor devices and methods of manufacture thereof | Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue | 2015-05-26 |
| 8890321 | Method of semiconducotr integrated circuit fabrication | Cheng-Hsiung Tsai, Chung-Ju Lee, Tien-I Bao | 2014-11-18 |
| 8778794 | Interconnection wires of semiconductor devices | Sunil Kumar Singh, Chung-Ju Lee, Hsiang-Huan Lee | 2014-07-15 |
| 8513821 | Overlay mark assistant feature | Hsien-Cheng Wang, Chien-Kai Huang, Chun-Kuang Chen | 2013-08-20 |