Issued Patents All Time
Showing 25 most recent of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12321351 | Multi-agent data asset synthesis system | Raja Shankar, Arpit Rajauria, Shaktidhar Reddy Pullagurla, Sherry Mangla, Joe Joseph | 2025-06-03 |
| 11955376 | Etch damage and ESL free dual damascene metal interconnect | Chung-Ju Lee, Tien-I Bao | 2024-04-09 |
| 11901304 | Integrated circuit structure with fluorescent material, and related methods | Vibhor Jain, Siva P. Adusumilli, Sebastian T. Ventrone, Johnatan A. Kantarovsky, Yves T. Ngu | 2024-02-13 |
| 11699650 | Integrated circuit structure with capacitor electrodes in different ILD layers, and related methods | Alamgir M. Arif, Dewei Xu, Seung Yeop Kook, Roderick A. Augur | 2023-07-11 |
| 11515205 | Conductive structures for contacting a top electrode of an embedded memory device and methods of making such contact structures on an IC product | Eswar Ramanathan, Xuan Anh Tran, Suryanarayana Kalaga, Juan Boon Tan | 2022-11-29 |
| 11380622 | Method and related structure to authenticate integrated circuit with authentication film | Vibhor Jain, Johnatan A. Kantarovsky, Siva P. Adusumilli, Sebastian T. Ventrone, John J. Ellis-Monaghan +1 more | 2022-07-05 |
| 11367750 | Vertical memory devices | Xuan Anh Tran, Eswar Ramanathan, Suryanarayana Kalaga, Craig Child, Robert FOX | 2022-06-21 |
| 11348867 | Capacitor structure for integrated circuit and related methods | Dewei Xu, Seung Yeop Kook, Roderick A. Augur | 2022-05-31 |
| 11211448 | Capacitor structure with MIM layer over metal pillars | Eswar Ramanathan | 2021-12-28 |
| 11171041 | Etch damage and ESL free dual damascene metal interconnect | Chung-Ju Lee, Tien-I Bao | 2021-11-09 |
| 11107880 | Capacitor structure for integrated circuit, and related methods | Dewei Xu, Siva R. Dangeti, Seung Yeop Kook | 2021-08-31 |
| 11094585 | Methods of forming a conductive contact structure to a top electrode of an embedded memory device on an IC product and a corresponding IC product | Xuan Anh Tran, Eswar Ramanathan, Suryanarayana Kalaga, Suresh Kumar Regonda, Juan Boon Tan | 2021-08-17 |
| 10886287 | Multiple-time programmable (MTP) memory device with a wrap-around control gate | Xuan Anh Tran, Shyue Seng Tan | 2021-01-05 |
| 10832842 | Insulating inductor conductors with air gap using energy evaporation material (EEM) | Jagar Singh | 2020-11-10 |
| 10818557 | Integrated circuit structure to reduce soft-fail incidence and method of forming same | Sipeng Gu, Akshey Sehgal, Xinyuan Dou, Ravi Prakash Srivastava, Haiting Wang +1 more | 2020-10-27 |
| 10777413 | Interconnects with non-mandrel cuts formed by early block patterning | Yuping Ren, Guoxiang Ning, Haigou Huang | 2020-09-15 |
| 10741495 | Structure and method to reduce shorts and contact resistance in semiconductor devices | Vinit O. Todi, Shao Beng Law | 2020-08-11 |
| 10735343 | Dynamic buffer allocation in similar infrastructures | Sudheesh S. Kairali, Vijay R. Kalangumvathakkal, Jagdish Kumar | 2020-08-04 |
| 10735342 | Dynamic buffer allocation in similar infrastructures | Sudheesh S. Kairali, Vijay R. Kalangumvathakkal, Jagdish Kumar | 2020-08-04 |
| 10714380 | Method of forming smooth sidewall structures using spacer materials | Ravi Prakash Srivastava, Sipeng Gu, Xinyuan Dou, Akshey Sehgal, Zhiguo Sun | 2020-07-14 |
| 10672710 | Interconnect structures with reduced capacitance | Shesh Mani Pandey | 2020-06-02 |
| 10643891 | Via structures and via patterning using oblique angle deposition processes | Qanit Takmeel, Somnath Ghosh, Anbu Selvam K M Mahalingam, Craig Child | 2020-05-05 |
| 10580684 | Self-aligned single diffusion break for fully depleted silicon-on-insulator and method for producing the same | Jin Z. Wallner, Katherina Babich | 2020-03-03 |
| 10567305 | Dynamic buffer allocation in similar infrastructures | Sudheesh S. Kairali, Vijay R. Kalangumvathakkal, Jagdish Kumar | 2020-02-18 |
| 10560396 | Dynamic buffer allocation in similar infrastructures | Sudheesh S. Kairali, Vijay R. Kalangumvathakkal, Jagdish Kumar | 2020-02-11 |