Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300594 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Sung Won Jeong | 2025-05-13 |
| 11699650 | Integrated circuit structure with capacitor electrodes in different ILD layers, and related methods | Alamgir M. Arif, Sunil Kumar Singh, Dewei Xu, Roderick A. Augur | 2023-07-11 |
| 11626364 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Sung Won Jeong | 2023-04-11 |
| 11348867 | Capacitor structure for integrated circuit and related methods | Dewei Xu, Sunil Kumar Singh, Roderick A. Augur | 2022-05-31 |
| 11107880 | Capacitor structure for integrated circuit, and related methods | Dewei Xu, Sunil Kumar Singh, Siva R. Dangeti | 2021-08-31 |
| 10861784 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Sung Won Jeong | 2020-12-08 |
| 10701806 | Printed circuit board including sub-circuit board | Yong Ho Baek, Jung-Hyun Cho | 2020-06-30 |
| 10679933 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Sung Won Jeong | 2020-06-09 |
| 10477683 | Printed circuit board including sub-circuit board | Yong Ho Baek, Jung-Hyun Cho | 2019-11-12 |
| 10461008 | Electronic component package having stress alleviation structure | Sung Won Jeong, Ji Hoon Kim, Sun Ho Kim, Shang Hoon Seo, Christian Romero | 2019-10-29 |
| 10446481 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Sung Won Jeong | 2019-10-15 |
| 10388614 | Fan-out semiconductor package and method of manufacturing same | Ji Hyun Lee, Kyoung Moo Harr, Ji Hoon Kim, Young Gwan Ko | 2019-08-20 |
| 10270948 | Substrate for camera module and camera module having the same | Seung Eun Lee, Jin Seon Park, Yul Kyo Chung, Chul CHOI, Dae Young Jung | 2019-04-23 |
| 10128179 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Sung Won Jeong | 2018-11-13 |
| 10115648 | Fan-out semiconductor package and electronic device including the same | Shang Hoon Seo, Ha Young Ahn, Sung Won Jeong, Young Gwan Ko | 2018-10-30 |
| 10062652 | Fan-out semiconductor package and method of manufacturing same | Ji Hyun Lee, Kyoung Moo Harr, Ji Hoon Kim, Young Gwan Ko | 2018-08-28 |
| 9929117 | Electronic component package and electronic device including the same | Ji Hyun Lee, Sung Won Jeong, Ha Young Ahn, Shang Hoon Seo | 2018-03-27 |
| 9859243 | Electronic component package and electronic device including the same | Ji Hyun Lee, Sung Won Jeong, Ha Young Ahn, Shang Hoon Seo | 2018-01-02 |
| 9839126 | Printed circuit board and method of manufacturing the same | Myung Sam Kang, Young Kwan Lee, Seung Eun Lee | 2017-12-05 |
| 9832885 | Circuit board, electronic component and method of manufacturing circuit board | Myung Sam Kang, Ki Jung SUNG, Seung Eun Lee | 2017-11-28 |
| 9420709 | Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same | Young Kwan Lee, Myung Sam Kang, Joo Hwan Jung, Ju-hee Park | 2016-08-16 |