Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741461 | Fan-out semiconductor package | Hyoung Joon Kim, Kyung Seob Oh | 2020-08-11 |
| 10622322 | Fan-out semiconductor package and method of manufacturing the fan-out semiconductor | Hyoung Joon Kim, Doo Hwan Lee, Kyung Seob Oh | 2020-04-14 |
| 10388614 | Fan-out semiconductor package and method of manufacturing same | Ji Hyun Lee, Seung Yeop Kook, Ji Hoon Kim, Young Gwan Ko | 2019-08-20 |
| 10224288 | Fan-out semiconductor package | Kyung Seob Oh, Doo Hwan Lee, Seung Chul Oh, Hyoung Joon Kim, Yoon Suk CHO | 2019-03-05 |
| 10211149 | Fan-out semiconductor package | Kyung Seob Oh, Hyoung Joon Kim | 2019-02-19 |
| 10170382 | Fan-out semiconductor package | Hyoung Joon Kim, Kyung Seob Oh | 2019-01-01 |
| 10154594 | Printed circuit board | Jeong Ho Lee, Young Do Kweon, Hyoung Joon Kim, Kyung Seob Oh | 2018-12-11 |
| 10062652 | Fan-out semiconductor package and method of manufacturing same | Ji Hyun Lee, Seung Yeop Kook, Ji Hoon Kim, Young Gwan Ko | 2018-08-28 |
| 10043758 | Fan-out semiconductor package | Ji Hyun Lee, Hyoung Joon Kim | 2018-08-07 |
| 9905526 | Electronic component package and method of manufacturing the same | Ji Hoon Kim, Kyung Seob Oh, Sun Ho Kim | 2018-02-27 |
| 9881873 | Fan-out semiconductor package | Kyung Seob Oh, Doo Hwan Lee, Seung Chul Oh, Hyoung Joon Kim, Yoon Suk CHO | 2018-01-30 |
| 8957319 | Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same | Sung-Wook Han, Yoon Su Kim, Kyung Seob Oh, Kyung Suk Shim, Du Sung Jung | 2015-02-17 |