Issued Patents All Time
Showing 1–25 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476215 | Semiconductor package | Jae Hoon Choi, Joo Young Choi, Sung Ho Han, Byung Ho Kim | 2022-10-18 |
| 11043441 | Fan-out semiconductor package | Tae-Je Cho | 2021-06-22 |
| 11011485 | Semiconductor package | Jae Hoon Choi, Joo Young Choi, Sung Ho Han, Byung Ho Kim | 2021-05-18 |
| 11011482 | Fan-out semiconductor package | Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh | 2021-05-18 |
| 10903170 | Substrate having embedded interconnect structure | Yong Hoon Kim, Tae-Je Cho, Jin Won Lee | 2021-01-26 |
| 10892227 | Fan-out semiconductor package | Hyoung Joon Kim | 2021-01-12 |
| 10887995 | Method for manufacturing a printed circuit board including an embedded electronic component | Seung Eun Lee, Yee Na Shin, Yul Kyo Chung | 2021-01-05 |
| 10886230 | Fan-out semiconductor package | Hyoung Joon Kim | 2021-01-05 |
| 10872863 | Semiconductor package | Joo Young Choi, Da Hee Kim, Jae Hoon Choi, Byung Ho Kim | 2020-12-22 |
| 10818621 | Fan-out semiconductor package | Hyoung Joon Kim, Dae Jung Byun | 2020-10-27 |
| 10714437 | Fan-out semiconductor package | Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh | 2020-07-14 |
| 10643919 | Fan-out semiconductor package | Hwa Sub Oh | 2020-05-05 |
| 10622322 | Fan-out semiconductor package and method of manufacturing the fan-out semiconductor | Hyoung Joon Kim, Kyoung Moo Harr, Kyung Seob Oh | 2020-04-14 |
| 10600748 | Fan-out semiconductor package | Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh | 2020-03-24 |
| 10566289 | Fan-out semiconductor package and manufacturing method thereof | Kyung Seob Oh, Jong Rip Kim, Hyoung Joon Kim | 2020-02-18 |
| 10448512 | Printed circuit board | Jong Rip Kim, Ung Hui Shin, Sung-Hwan Cho | 2019-10-15 |
| 10332855 | Fan-out semiconductor package | Ju Hyeon KIM, Dae Kyu Ahn, Sung Won Jeong | 2019-06-25 |
| 10276467 | Fan-out semiconductor package | Eun Sil Kim, Dae Jung Byun, Tae Ho Ko, Yeong A Kim | 2019-04-30 |
| 10224288 | Fan-out semiconductor package | Kyung Seob Oh, Kyoung Moo Harr, Seung Chul Oh, Hyoung Joon Kim, Yoon Suk CHO | 2019-03-05 |
| 10134695 | Fan-out semiconductor package | Ju Hyeon KIM, Hyoung Joon Kim, Joon-Sung Kim | 2018-11-20 |
| 10091711 | Network searching by device supporting multiple communication methods | Young Ho Yoon, Jun-Ki SEO, Sung Hyun Ryu, Ki Won Lee | 2018-10-02 |
| 10015884 | Printed circuit board including embedded electronic component and method for manufacturing the same | Seung Eun Lee, Yee Na Shin, Yul Kyo Chung | 2018-07-03 |
| 9929100 | Electronic component package and method of manufacturing the same | Hyoung Joon Kim, Jong Rip Kim, Kyung Seob Oh, Ung Hui Shin | 2018-03-27 |
| 9894770 | Embedded electronic component and method of manufacturing electronic component embedded substrate | — | 2018-02-13 |
| 9881873 | Fan-out semiconductor package | Kyung Seob Oh, Kyoung Moo Harr, Seung Chul Oh, Hyoung Joon Kim, Yoon Suk CHO | 2018-01-30 |