Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12219692 | Printed circuit board | Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Tae Hong Min, Jin Won Lee | 2025-02-04 |
| 11864307 | Printed circuit board | Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Tae Hong Min, Jin Won Lee | 2024-01-02 |
| 11758650 | Flexible printed circuit board and electronic device including the same | Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee | 2023-09-12 |
| 11744012 | Printed circuit board and substrate including electronic component embedded therein | Mi Sun Hwang, Jung Soo Kim, Jin Won Lee, Duck Young Maeng | 2023-08-29 |
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na +4 more | 2023-05-02 |
| 11631643 | Substrate embedded electronic component package | Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Mi Sun Hwang, Yong-duk Lee +2 more | 2023-04-18 |
| 11587878 | Substrate having electronic component embedded therein | Chang Hwa Park, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong-duk Lee +1 more | 2023-02-21 |
| 11576254 | Cable substrate | Jung Soo Kim, Sang Hyun Sim, Chang Min Ha | 2023-02-07 |
| 11251133 | Substrate having electronic component embedded therein | Chang Hwa Park, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong-duk Lee +1 more | 2022-02-15 |
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na +4 more | 2021-11-23 |
| 11075156 | Substrate having electronic component embedded therein | Yong-duk Lee, Chang Hwa Park, Ki Ho Na, Je Sang Park, Jin Won Lee | 2021-07-27 |
| 10818621 | Fan-out semiconductor package | Doo Hwan Lee, Hyoung Joon Kim | 2020-10-27 |
| 10515916 | Fan-out semiconductor package | Byung Ho Kim, Pyung Hwa Han, Joo Young Choi, Ung Hui Shin | 2019-12-24 |
| 10276467 | Fan-out semiconductor package | Eun Sil Kim, Doo Hwan Lee, Tae Ho Ko, Yeong A Kim | 2019-04-30 |
| 10157868 | Fan-out semiconductor package | Byung Ho Kim, Pyung Hwa Han, Joo Young Choi, Ung Hui Shin | 2018-12-18 |
| 9859222 | Fan-out semiconductor package | Jung Soo Kim, Doo Hwan Lee | 2018-01-02 |
| 8418356 | Method of manufacturing an embedded printed circuit board | Kwang Soo Park, Myung Gun Chong, Dek-Gin Yang | 2013-04-16 |
| 8037584 | Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes | Kwang Soo Park, Sim-Hwan Park, Jeong-Yeon Jeong | 2011-10-18 |
| 7665206 | Printed circuit board and manufacturing method thereof | Kwang Soo Park, Dong-Sam You, Bong-Soo Kim, Myung Gun Chong | 2010-02-23 |