Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2023-05-02 |
| 11587878 | Substrate having electronic component embedded therein | Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Yong-duk Lee +1 more | 2023-02-21 |
| 11251133 | Substrate having electronic component embedded therein | Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Yong-duk Lee +1 more | 2022-02-15 |
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2021-11-23 |
| 11075156 | Substrate having electronic component embedded therein | Dae Jung Byun, Yong-duk Lee, Chang Hwa Park, Je Sang Park, Jin Won Lee | 2021-07-27 |