Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515916 | Fan-out semiconductor package | Dae Jung Byun, Byung Ho Kim, Pyung Hwa Han, Joo Young Choi | 2019-12-24 |
| 10448512 | Printed circuit board | Doo Hwan Lee, Jong Rip Kim, Sung-Hwan Cho | 2019-10-15 |
| 10157868 | Fan-out semiconductor package | Dae Jung Byun, Byung Ho Kim, Pyung Hwa Han, Joo Young Choi | 2018-12-18 |
| 9929100 | Electronic component package and method of manufacturing the same | Doo Hwan Lee, Hyoung Joon Kim, Jong Rip Kim, Kyung Seob Oh | 2018-03-27 |