Issued Patents All Time
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309924 | Connection structure embedded substrate and substrate structure including the same | Ho Hyung Ham, Yong Soon Jang, Ki-Suk Kim, Hyung Ki Lee, Chi Won Hwang | 2025-05-20 |
| 12262467 | Printed circuit board including an insulating layer and a metal post | Eun Su Kwon | 2025-03-25 |
| 12219692 | Printed circuit board | Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee | 2025-02-04 |
| 12183718 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2024-12-31 |
| 11894346 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2024-02-06 |
| 11864307 | Printed circuit board | Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee | 2024-01-02 |
| 11769622 | Inductor device and method of manufacturing the same | In Seok KIM, Yong Jin Park, Young Gwan Ko, Youn-Soo Seo, Myung Sam Kang | 2023-09-26 |
| 11737211 | Connection structure embedded substrate and substrate structure including the same | Ho Hyung Ham, Yong Soon Jang, Ki-Suk Kim, Hyung Ki Lee, Chi Won Hwang | 2023-08-22 |
| 11664352 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2023-05-30 |
| 11558961 | Printed circuit board | Jungwoo Choi | 2023-01-17 |
| 11490512 | Printed circuit board and antenna module comprising the same | Ju Ho Kim | 2022-11-01 |
| 11445598 | Printed circuit board and antenna module comprising the same | Ju Ho Kim | 2022-09-13 |
| 11437724 | Antenna module | — | 2022-09-06 |
| 11394104 | Printed circuit board and antenna module comprising the same | — | 2022-07-19 |
| 11272613 | Printed circuit board and package including printed circuit board | Ju Ho Kim | 2022-03-08 |
| 11122694 | Printed circuit board and package having the same | Ju Ho Kim | 2021-09-14 |
| 11057993 | Printed circuit board | — | 2021-07-06 |
| 11018115 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2021-05-25 |
| 10952316 | Printed circuit board | Ju Ho Kim | 2021-03-16 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Sang-Sick Park, Un-Byoung Kang, Teak-Hoon Lee, Ji Hwan Hwang | 2021-02-23 |
| 10847300 | Inductor and method of manufacturing the same | Jung Woo Choi, Jin Hong, Il Jong Seo, Sa Yong Lee, Myung Sam Kang | 2020-11-24 |
| 10651154 | Semiconductor packages | Sang-Sick Park, Geol Nam, Jihwan Hwang | 2020-05-12 |
| 10622335 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2020-04-14 |
| 10497675 | Semiconductor device including multiple semiconductor chips | Byoung-Soo Kwak, In-Young Lee, Tae-Je Cho | 2019-12-03 |
| 10362667 | Circuit board and manufacturing method thereof | Myung Sam Kang, Jung Han Lee, Young Gwan Ko | 2019-07-23 |