Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183718 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2024-12-31 |
| 12113050 | Semiconductor package with increased thermal radiation efficiency | Un-Byoung Kang, Jongho Lee, Teak-Hoon Lee | 2024-10-08 |
| 12074142 | Semiconductor package and method of fabricating the same | Jongpa HONG, Hwail Jin | 2024-08-27 |
| 11948903 | Semiconductor package | Un-Byoung Kang, Seon Gyo Kim, Joon Ho Jun | 2024-04-02 |
| 11901339 | Semiconductor package including a fillet layer | Min Soo Kim | 2024-02-13 |
| 11894346 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2024-02-06 |
| 11664352 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2023-05-30 |
| 11616039 | Semiconductor package | Un-Byoung Kang, Seon Gyo Kim, Joon Ho Jun | 2023-03-28 |
| 11362068 | Semiconductor package including a fillet layer | Min Soo Kim | 2022-06-14 |
| 11018115 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2021-05-25 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Un-Byoung Kang, Tae Hong Min, Teak-Hoon Lee, Ji Hwan Hwang | 2021-02-23 |
| 10651154 | Semiconductor packages | Geol Nam, Tae Hong Min, Jihwan Hwang | 2020-05-12 |
| 10622335 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2020-04-14 |
| 10153255 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2018-12-11 |
| 10090278 | Semiconductor packages | Geol Nam, Tae Hong Min, Jihwan Hwang | 2018-10-02 |
| 9171825 | Semiconductor device and method of fabricating the same | In-Young Lee, Byoung-Soo Kwak, Min Soo Kim, Sang Wook Park, Tae-Je Cho | 2015-10-27 |
| 9136260 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im, Chang-Seong Jeon +1 more | 2015-09-15 |
| 8958011 | Bi-directional camera module and flip chip bonder including the same | Myung-Sung Kang, Ji-Seok Hong | 2015-02-17 |
| 8901727 | Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages | Myun-sung Kang, Jung Ko, Won Keun Kim, Ji-Seok Hong | 2014-12-02 |
| 8697494 | Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method | Chang-Seong Jeon, Ho-Geon Song, Mitsuo Umemoto | 2014-04-15 |
| 8637350 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im, Chang-Seong Jeon +1 more | 2014-01-28 |
| 8637989 | Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes | Ho-Jin Lee, Hyun-Soo Chung, Chang-Seong Jeon, Jae-hyun Phee | 2014-01-28 |
| 8513802 | Multi-chip package having semiconductor chips of different thicknesses from each other and related device | Keum-Hee Ma, Woo-Dong Lee, Min-Seung Yoon, Ju-Il Choi, Son-Kwan Hwang | 2013-08-20 |