Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10105102 | Package for processing sensed-data, sensed-data processor, and system for processing sensed-data | Yung-Cheol Kong, Woon-bae Kim, Pyoung-Wan Kim, Kyong-Soon Cho | 2018-10-23 |
| 9991245 | Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same | Jae Choon Kim, Donghan Kim, Jikho Song, Inho Choi | 2018-06-05 |
| 9917010 | Semiconductor device manufacturing method | Hideaki Yoshimi, Kazumi Onda, Kazumi Horinaka | 2018-03-13 |
| 9589842 | Semiconductor package and method of fabricating the same | Inho Choi, Donghan Kim, Jae Choon Kim, Jikho Song | 2017-03-07 |
| 9165898 | Method of manufacturing semiconductor device with through hole | Kojiro Kameyama, Akira Suzuki, Yoshio Okayama | 2015-10-20 |
| 8736047 | Semiconductor device and manufacturing method thereof | Hideaki Yoshimi, Kazumi Onda, Kazumi Horinaka | 2014-05-27 |
| 8697494 | Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method | Chang-Seong Jeon, Ho-Geon Song, Sang-Sick Park | 2014-04-15 |
| 8552545 | Manufacturing method for semiconductor device, semiconductor device and semiconductor chip | Kazumasa Tanida, Yukiharu Akiyama | 2013-10-08 |
| 8404586 | Manufacturing method for semiconductor device | Kazumasa Tanida, Yukiharu Akiyama | 2013-03-26 |
| 8089163 | Semiconductor device production method and semiconductor device | Kazumasa Tanida, Yoshihiko Nemoto | 2012-01-03 |
| 8076755 | Semiconductor device and method of manufacturing the same | Shigehito Matsumoto, Hirotoshi Kubo, Yukari Shirahata, Masamichi Yamamuro, Koujiro Kameyama | 2011-12-13 |
| 8004848 | Stack module, card including the stack module, and system including the stack module | Seung-Duk Baek, Kang-Wook Lee | 2011-08-23 |
| 7906430 | Method of manufacturing a semiconductor device with a peeling prevention layer | Kojiro Kameyama, Akira Suzuki | 2011-03-15 |
| 7750478 | Semiconductor device with via hole of uneven width | Koujiro Kameyama, Akira Suzuki, Yoshio Okayama, Kenji Takahashi, Hiroshi Terao +1 more | 2010-07-06 |
| 7732925 | Semiconductor device and manufacturing method thereof | Yoshio Okayama, Akira Suzuki, Koujiro Kameyama, Kenji Takahashi, Hiroshi Terao +1 more | 2010-06-08 |
| 7670955 | Semiconductor device and manufacturing method of the same | Kojiro Kameyama, Akira Suzuki | 2010-03-02 |
| 7646079 | Semiconductor device, method of manufacturing the same, circuit board, and method of manufacturing the same | — | 2010-01-12 |
| 7646100 | Semiconductor device with penetrating electrode | Kojiro Kameyama, Akira Suzuki | 2010-01-12 |
| 7638421 | Manufacturing method for semiconductor device and semiconductor device | Kazumasa Tanida, Yoshihiko Nemoto | 2009-12-29 |
| 7582971 | Semiconductor device and manufacturing method of the same | Kojiro Kameyama, Akira Suzuki | 2009-09-01 |
| 7495881 | Chucking method and processing method using the same | Kojiro Kameyama, Akira Suzuki, Yoshio Okayama | 2009-02-24 |
| 7485967 | Semiconductor device with via hole for electric connection | Kojiro Kameyama, Akira Suzuki, Yoshio Okayama | 2009-02-03 |
| 7416963 | Manufacturing method of semiconductor device | Yoshio Okayama, Kazumasa Tanida, Hiroshi Terao, Yoshihiko Nemoto | 2008-08-26 |
| 7397128 | Semiconductor device and method of manufacturing the same | Hirotoshi Kubo, Yukari Shirahata, Shigehito Matsumoto, Masamichi Yamamuro, Koujiro Kameyama | 2008-07-08 |
| 7382037 | Semiconductor device with a peeling prevention layer | Kojiro Kameyama, Akira Suzuki | 2008-06-03 |