Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867857 | Method of cutting substrate and method of singulating semiconductor chips | Seung-Hun Shin, Jae-Kyung Yoo, Teak-Hoon Lee | 2020-12-15 |
| 9461029 | Semiconductor packages and methods for fabricating the same | Hye-Young Jang, Chajea Jo, Taeje Cho | 2016-10-04 |
| 9245787 | Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same | Sangwook Park, Teakhoon Lee, Ilyoung Han | 2016-01-26 |
| 9177942 | Semiconductor package and method of fabricating the same | Wonkeun Kim, In-Young Lee, Taeje Cho | 2015-11-03 |
| 9136260 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im, Teak-Hoon Lee +1 more | 2015-09-15 |
| 9082871 | Substrate of semiconductor package and method of fabricating semiconductor package using the same | Gi-Jun Park, Won Keun Kim, Teak-Hoon Lee, Young Kun Jee | 2015-07-14 |
| 8987904 | Substrate of semiconductor package and method of fabricating semiconductor package using the same | Gi-Jun Park, Won Keun Kim, Teak-Hoon Lee, Young Kun Jee | 2015-03-24 |
| 8697494 | Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method | Ho-Geon Song, Mitsuo Umemoto, Sang-Sick Park | 2014-04-15 |
| 8637350 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im, Teak-Hoon Lee +1 more | 2014-01-28 |
| 8637989 | Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes | Ho-Jin Lee, Hyun-Soo Chung, Sang-Sick Park, Jae-hyun Phee | 2014-01-28 |