Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300665 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Ji Hwang Kim, Jong Bo Shim | 2025-05-13 |
| 11935873 | Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips | Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee | 2024-03-19 |
| 11621250 | Semiconductor packages | Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee | 2023-04-04 |
| 11488910 | Semiconductor package having redistribution layer | Il Hwan Kim, Un-Byoung Kang | 2022-11-01 |
| 11282792 | Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads | Hae-Jung Yu, Sangwon Kim, Un-Byoung Kang, Jongho Lee, Dae-Woo Kim +1 more | 2022-03-22 |
| 11227855 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Ji Hwang Kim, Jong Bo Shim | 2022-01-18 |
| 11222873 | Semiconductor packages including stacked substrates and penetration electrodes | Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee | 2022-01-11 |
| 10818603 | Semiconductor package having redistribution layer | II Hwan Kim, Un-Byoung Kang | 2020-10-27 |
| 10685921 | Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same | Ji Hwang Kim, Un-Byoung Kang | 2020-06-16 |
| 10020290 | Semiconductor device having stacked semiconductor chips interconnected via TSV | Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Sang-Uk Han | 2018-07-10 |
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Sang-Uk Han | 2017-08-01 |
| 9721930 | Semiconductor package and method for fabricating the same | Hyoungjoo Lee, Minsoo Kim, Teak-Hoon Lee | 2017-08-01 |
| 9589947 | Semiconductor packages and methods of manufacturing the same | Jihwan Hwang, Jung-Hwan Kim, Tae Hong Min, Kwang-chul Choi | 2017-03-07 |
| 9543276 | Chip-stacked semiconductor package | Tae Hong Min, Sun-kyoung Seo | 2017-01-10 |
| 9376541 | Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package | Un-Byoung Kang, Kyung Wook Paik, Tae-Je Cho, Sun-kyoung Seo, Yong Won Choi +1 more | 2016-06-28 |
| 9324683 | Semiconductor package and method of manufacturing the same | Tae Hong Min, Tae-Je Cho | 2016-04-26 |
| 9159651 | Semiconductor packages having TSV and adhesive layer | Teak-Hoon Lee, Ji Hwang Kim, Sang Wook Park | 2015-10-13 |
| 9082871 | Substrate of semiconductor package and method of fabricating semiconductor package using the same | Gi-Jun Park, Won Keun Kim, Teak-Hoon Lee, Chang-Seong Jeon | 2015-07-14 |
| 8987904 | Substrate of semiconductor package and method of fabricating semiconductor package using the same | Gi-Jun Park, Won Keun Kim, Teak-Hoon Lee, Chang-Seong Jeon | 2015-03-24 |
| 8802495 | Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same | Ji Hwang Kim, Tae Hong Min, Chajea Jo, Taeje Cho, Yun-Seok Choi | 2014-08-12 |
| 8742577 | Semiconductor package having an anti-contact layer | Sun-kyoung Seo, Sang Wook Park, Ji Hwan Hwang | 2014-06-03 |