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Semiconductor package |
Jang-woo Lee, Un-Byoung Kang, Ji Hwang Kim, Jong Bo Shim |
2025-05-13 |
| 11935873 |
Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips |
Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee |
2024-03-19 |
| 11621250 |
Semiconductor packages |
Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee |
2023-04-04 |
| 11488910 |
Semiconductor package having redistribution layer |
Il Hwan Kim, Un-Byoung Kang |
2022-11-01 |
| 11282792 |
Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads |
Hae-Jung Yu, Sangwon Kim, Un-Byoung Kang, Jongho Lee, Dae-Woo Kim +1 more |
2022-03-22 |
| 11227855 |
Semiconductor package |
Jang-woo Lee, Un-Byoung Kang, Ji Hwang Kim, Jong Bo Shim |
2022-01-18 |
| 11222873 |
Semiconductor packages including stacked substrates and penetration electrodes |
Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee |
2022-01-11 |
| 10818603 |
Semiconductor package having redistribution layer |
II Hwan Kim, Un-Byoung Kang |
2020-10-27 |
| 10685921 |
Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same |
Ji Hwang Kim, Un-Byoung Kang |
2020-06-16 |
| 10020290 |
Semiconductor device having stacked semiconductor chips interconnected via TSV |
Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Sang-Uk Han |
2018-07-10 |
| 9721926 |
Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same |
Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Sang-Uk Han |
2017-08-01 |
| 9721930 |
Semiconductor package and method for fabricating the same |
Hyoungjoo Lee, Minsoo Kim, Teak-Hoon Lee |
2017-08-01 |
| 9589947 |
Semiconductor packages and methods of manufacturing the same |
Jihwan Hwang, Jung-Hwan Kim, Tae Hong Min, Kwang-chul Choi |
2017-03-07 |
| 9543276 |
Chip-stacked semiconductor package |
Tae Hong Min, Sun-kyoung Seo |
2017-01-10 |
| 9376541 |
Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package |
Un-Byoung Kang, Kyung Wook Paik, Tae-Je Cho, Sun-kyoung Seo, Yong Won Choi +1 more |
2016-06-28 |
| 9324683 |
Semiconductor package and method of manufacturing the same |
Tae Hong Min, Tae-Je Cho |
2016-04-26 |
| 9159651 |
Semiconductor packages having TSV and adhesive layer |
Teak-Hoon Lee, Ji Hwang Kim, Sang Wook Park |
2015-10-13 |
| 9082871 |
Substrate of semiconductor package and method of fabricating semiconductor package using the same |
Gi-Jun Park, Won Keun Kim, Teak-Hoon Lee, Chang-Seong Jeon |
2015-07-14 |
| 8987904 |
Substrate of semiconductor package and method of fabricating semiconductor package using the same |
Gi-Jun Park, Won Keun Kim, Teak-Hoon Lee, Chang-Seong Jeon |
2015-03-24 |
| 8802495 |
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same |
Ji Hwang Kim, Tae Hong Min, Chajea Jo, Taeje Cho, Yun-Seok Choi |
2014-08-12 |
| 8742577 |
Semiconductor package having an anti-contact layer |
Sun-kyoung Seo, Sang Wook Park, Ji Hwan Hwang |
2014-06-03 |
