Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935873 | Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips | Un-Byoung Kang, Sunkyoung Seo, Jongho Lee, Young Kun Jee | 2024-03-19 |
| 11688707 | Semiconductor package | Sangsick Park, Unbyoung Kang | 2023-06-27 |
| 11621250 | Semiconductor packages | Un-Byoung Kang, Sunkyoung Seo, Jongho Lee, Young Kun Jee | 2023-04-04 |
| 11222873 | Semiconductor packages including stacked substrates and penetration electrodes | Un-Byoung Kang, Sunkyoung Seo, Jongho Lee, Young Kun Jee | 2022-01-11 |