Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176313 | Semiconductor package | Hyoungjoo Lee, Unbyoung Kang, Sechul Park, Hyojin Yun, Teakhoon Lee +1 more | 2024-12-24 |
| 11791308 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2023-10-17 |
| 11688707 | Semiconductor package | Joonho Jun, Unbyoung Kang | 2023-06-27 |
| 11469099 | Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages | Jungmin Ko, Hyeongmun Kang, Hyeonjun Song | 2022-10-11 |
| 11362062 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2022-06-14 |