JS

Jihwan Suh

Samsung: 10 patents #13,191 of 75,807Top 20%
Overall (All Time): #489,216 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12040313 Semiconductor package and a method for manufacturing the same Hyuekjae Lee, Jihoon Kim, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more 2024-07-16
11955449 Stacked semiconductor package Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Jihwan Hwang, Sang Cheon Park 2024-04-09
11791308 Semiconductor package Jihwan Hwang, Unbyoung Kang, Sangsick Park, Soyoun Lee, Teakhoon Lee 2023-10-17
11764192 Semiconductor package including underfill material layer and method of forming the same Jihwan Hwang, Taehun Kim, Soyoun Lee, Hyuekjae Lee, Jiseok Hong 2023-09-19
11721673 Semiconductor package having stacked semiconductor chips Hyuekjae Lee, Jihoon Kim, Soyoun Lee, Jiseok Hong, Taehun Kim +1 more 2023-08-08
11658148 Semiconductor package and a method for manufacturing the same Hyuekjae Lee, Jihoon Kim, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more 2023-05-23
11508685 Stacked semiconductor package Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Jihwan Hwang, Sang Cheon Park 2022-11-22
11404395 Semiconductor package including underfill material layer and method of forming the same Jihwan Hwang, Taehun Kim, Soyoun Lee, Hyuekjae Lee, Jiseok Hong 2022-08-02
11362062 Semiconductor package Jihwan Hwang, Unbyoung Kang, Sangsick Park, Soyoun Lee, Teakhoon Lee 2022-06-14
11244927 Semiconductor package having stacked semiconductor chips Hyuekjae Lee, Jihoon Kim, Soyoun Lee, Jiseok Hong, Taehun Kim +1 more 2022-02-08