Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261164 | Semiconductor package | Sang Cheon Park, Dae-Woo Kim, Taehun Kim | 2025-03-25 |
| 12237308 | Semiconductor package | Dae-Woo Kim, Eunseok Song | 2025-02-25 |
| 12132019 | Packaged multi-chip semiconductor devices and methods of fabricating same | Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park, Jinkyeong Seol +1 more | 2024-10-29 |
| 12040313 | Semiconductor package and a method for manufacturing the same | Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more | 2024-07-16 |
| 11984421 | Integrated circuit chip having BS-PDN structure | Eunseok Song, Hongjoo Baek, Kyungsuk Oh, Manho Lee | 2024-05-14 |
| 11955449 | Stacked semiconductor package | Jihwan Suh, Un-Byoung Kang, Taehun Kim, Jihwan Hwang, Sang Cheon Park | 2024-04-09 |
| 11901336 | Semiconductor package | Dae-Woo Kim, Eunseok Song | 2024-02-13 |
| 11798929 | Semiconductor package | Sang Cheon Park, Dae-Woo Kim, Taehun Kim | 2023-10-24 |
| 11764192 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong | 2023-09-19 |
| 11721673 | Semiconductor package having stacked semiconductor chips | Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong, Taehun Kim +1 more | 2023-08-08 |
| 11694996 | Semiconductor package including a pad contacting a via | Un-Byoung Kang, Sang Cheon Park, Jinkyeong Seol, Sanghoon Lee | 2023-07-04 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Jiseok Hong, Jongpa HONG, Jihwan Hwang, Taehun Kim | 2023-06-13 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park +1 more | 2023-05-23 |
| 11658148 | Semiconductor package and a method for manufacturing the same | Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more | 2023-05-23 |
| 11552033 | Packaged multi-chip semiconductor devices and methods of fabricating same | Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park, Jinkyeong Seol +1 more | 2023-01-10 |
| 11527509 | Semiconductor package | Sanghoon Lee | 2022-12-13 |
| 11508685 | Stacked semiconductor package | Jihwan Suh, Un-Byoung Kang, Taehun Kim, Jihwan Hwang, Sang Cheon Park | 2022-11-22 |
| 11404395 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong | 2022-08-02 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park +1 more | 2022-03-29 |
| 11244927 | Semiconductor package having stacked semiconductor chips | Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong, Taehun Kim +1 more | 2022-02-08 |
| 11158594 | Semiconductor packages having improved reliability in bonds between connection conductors and pads | Jiseok Hong, Jongpa HONG, Jihwan Hwang, Taehun Kim | 2021-10-26 |
| 8558371 | Method for wafer level package and semiconductor device fabricated using the same | JiSun Hong, Taeje Cho, Un-Byoung Kang, Youngbok Kim, Hyung-Sun Jang | 2013-10-15 |
| 8399987 | Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers | Woonseong Kwon, Taeje Cho, Yonghwan Kwon, Jung-Hwan Kim, Chiyoung Lee +1 more | 2013-03-19 |