KO

Kyungsuk Oh

Samsung: 15 patents #9,125 of 75,807Top 15%
Overall (All Time): #304,160 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12388048 Semiconductor package comprising heat spreader Sungeun JO, Youngdeuk Kim, Jaechoon Kim, Taehwan Kim 2025-08-12
12237268 Integrated circuit semiconductor device Jaechoon Kim, Seunggeol Ryu, Keungbeum Kim, Eonsoo Jang 2025-02-25
12211829 Semiconductor package Manho Lee, Eunseok Song, Seonghwan Jeon 2025-01-28
12199002 Semiconductor package and method of manufacturing the same Taehwan Kim, Jaechoon Kim 2025-01-14
12057441 Semiconductor package including a plurality of semiconductor chips Manho Lee, Eunseok Song 2024-08-06
12009303 Integrated circuit semiconductor device Jaechoon Kim, Seunggeol Ryu, Keungbeum Kim, Eonsoo Jang 2024-06-11
11996398 Semiconductor package and method of manufacturing the same Eunseok Song, Seho You 2024-05-28
11984421 Integrated circuit chip having BS-PDN structure Eunseok Song, Hongjoo Baek, Manho Lee, Hyuekjae Lee 2024-05-14
11742329 Semiconductor package Jongho Park, Hyunki Kim, Yongkwan Lee, Sangsoo Kim, Seungkon Mok +2 more 2023-08-29
11631660 Semiconductor package Manho Lee, Eunseok Song, Seonghwan Jeon 2023-04-18
11482516 Semiconductor package and method of manufacturing the same Eunseok Song, Seho You 2022-10-25
11482507 Semiconductor package having molding member and heat dissipation member Sunchul Kim, Taehun Kim, Pyoungwan Kim, Soohwan Lee 2022-10-25
11257786 Semiconductor package including molding member, heat dissipation member, and reinforcing member Sunchul Kim, Taehun Kim, Pyoungwan Kim 2022-02-22
11101243 Semiconductor package Jongho Park, Hyunki Kim, Yongkwan Lee, Sangsoo Kim, Seungkon Mok +2 more 2021-08-24
10699056 Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit board Youngbae Kim 2020-06-30