| 12431403 |
Semiconductor package including thermal interface material (TIM) layers on semiconductor chips |
Kiwook Jung, Jaechoon Kim, Seunggeol Ryu |
2025-09-30 |
| 12388048 |
Semiconductor package comprising heat spreader |
Youngdeuk Kim, Jaechoon Kim, Taehwan Kim, Kyungsuk Oh |
2025-08-12 |
| 11393859 |
Image sensor package |
Youngshin Kwon |
2022-07-19 |
| 11131568 |
Sensor package, method of manufacturing the same, and method of manufacturing lid structure |
Youngshin Kwon, Minjin Kim, Woonbae Kim, Youngdoo Jung, Eunhee Jung +1 more |
2021-09-28 |
| 11125734 |
Gas sensor package |
Inho Choi, Minjin Kim, Sungwoo Park, Youngdoo Jung, Eunhee Jung |
2021-09-21 |
| 11067554 |
Gas sensor package and sensing apparatus including the same |
Minjin Kim, Youngdoo Jung, Eunhee Jung, Inho Choi |
2021-07-20 |
| 10776601 |
Fingerprint sensor package and display apparatus including the same |
Woonbae Kim, Jikho Song, Ji-Yong Park, Jeong-Kyu Ha |
2020-09-15 |
| 10760930 |
Sensor package, method of manufacturing the same, and method of manufacturing lid structure |
Youngshin Kwon, Minjin Kim, Woonbae Kim, Youngdoo Jung, Eunhee Jung +1 more |
2020-09-01 |
