Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431403 | Semiconductor package including thermal interface material (TIM) layers on semiconductor chips | Kiwook Jung, Jaechoon Kim, Seunggeol Ryu | 2025-09-30 |
| 12388048 | Semiconductor package comprising heat spreader | Youngdeuk Kim, Jaechoon Kim, Taehwan Kim, Kyungsuk Oh | 2025-08-12 |
| 11393859 | Image sensor package | Youngshin Kwon | 2022-07-19 |
| 11131568 | Sensor package, method of manufacturing the same, and method of manufacturing lid structure | Youngshin Kwon, Minjin Kim, Woonbae Kim, Youngdoo Jung, Eunhee Jung +1 more | 2021-09-28 |
| 11125734 | Gas sensor package | Inho Choi, Minjin Kim, Sungwoo Park, Youngdoo Jung, Eunhee Jung | 2021-09-21 |
| 11067554 | Gas sensor package and sensing apparatus including the same | Minjin Kim, Youngdoo Jung, Eunhee Jung, Inho Choi | 2021-07-20 |
| 10776601 | Fingerprint sensor package and display apparatus including the same | Woonbae Kim, Jikho Song, Ji-Yong Park, Jeong-Kyu Ha | 2020-09-15 |
| 10760930 | Sensor package, method of manufacturing the same, and method of manufacturing lid structure | Youngshin Kwon, Minjin Kim, Woonbae Kim, Youngdoo Jung, Eunhee Jung +1 more | 2020-09-01 |